W. L. Gore & Associates, Inc. Introducing New GORE® PHASEFLEX® Microwave/RF Test Assemblies

High-density and modular test instruments for wireless devices and aerospace systems have become increasingly complex, with a larger number of ports that can accept up to 32 test assemblies or more. They're also subjected to constant flexing during calibration and testing DUTs (Device Under Test) that can compromise phase and amplitude stability, resulting in inaccurate measurements. As such, test assemblies need to be smaller, lighter weight and more flexible for easy routing in less space when connecting them to Vector Network Analyzers (VNAs), like ENA and PXIe. At the same time, they need to deliver highly accurate measurements for faster throughput, less calibration and downtime, and reduced overall costs.

To address these demanding requirements, Gore has introduced GORE^® PHASEFLEX^® Microwave/RF Test Assemblies, Type 0N – the smallest, lightest, most internally ruggedized assembly on the market today for modular, multi-port, and multi-site test applications.

Extremely durable and highly stable performance over time

Building on the portfolio of GORE^® PHASEFLEX^® Microwave/RF Test Assemblies, the unprecedented small package and light weight of Type 0N not only makes initial routing much easier in cramped spaces but also reduces the stress on test ports and DUTs as cables are connected to test instrument ports and fixtures. This high-density test assembly also withstands continuous movement and flexing while delivering enhanced phase and amplitude stability.

Increased test efficiency, reduced test cost

Connecting the new GORE^® PHASEFLEX^® Microwave/RF Test Assemblies, Type 0N to a test application eases calibration and troubleshooting, improves test results, speeds throughput, increases service life, and reduces overall costs. This new assembly solution from Gore offers stable electrical performance and durable mechanical protection over time in a compact, cost-effective package.

The combination of protection and performance coupled with reduced size and weight makes the new GORE^® PHASEFLEX^® Microwave/RF Test Assemblies, Type 0N ideal for modular, multi-port, and multi-site test applications such as:

• 5G test and interconnection
• Component/device R&D and production test
• High-speed digital test devices/assemblies
• Modular test instruments such as PXIe and AXIe
• RF switches

For more information, visit gore.com/electronics, or contact a Gore applications specialist at [email protected].

About Gore
W. L. Gore & Associates is a global materials science company dedicated to transforming industries and improving lives. Founded in 1958, Gore has built a reputation for solving complex technical challenges in the most demanding environments — from revolutionizing the outerwear industry with GORE-TEX® fabric to creating medical devices that improve and save lives to enabling new levels of performance in the aerospace, pharmaceutical and mobile electronics markets, among other industries. The company is also known for its strong, team-oriented culture and continued recognition from the Great Place to Work® Institute. Headquartered in Newark, Del., Gore employs approximately 10,000 Associates and generates annual revenues that exceed $3 billion. www.gore.com

Performance Solutions Division
Gore Performance Solutions Division develops products and technologies that address complex product and process challenges in a variety of markets and industries, including aerospace, automotive, pharmaceutical, mobile electronics, oil and gas — and more. Through close collaboration with industry leaders across the globe, Gore enables customers to design their products and processes to be safer, cleaner, more productive, reliable, durable and efficient across a wide range of demanding environments.

SOURCE W. L. Gore & Associates