UMC Listed on CDP's Climate Performance Leadership Index

HSINCHU, Taiwan, Nov. 13, 2015 /PRNewswire/ -- United Microelectronics Corporation (NYSE: UMC; TWSE: 2303) ("UMC"), a leading global semiconductor foundry, today announced that it has again been listed as a Climate Performance Leadership Index (CPLI) component by Carbon Disclosure Project (CDP), earning the highest Carbon Disclosure Score among Taiwan semiconductor companies for the third consecutive year and the highest ranking for Carbon Performance Bond among all Taiwanese enterprises. This achievement underscores UMC's continuous efforts toward corporate climate change policy and transparent disclosure of climate change-related information, which has achieved industry-leading performance and earned international recognition from investors.

Po Wen Yen, CEO at UMC, said, "UMC sees climate risk as both a challenge and an opportunity. We incorporate climate change concepts within our operational development, and work with supply chain partners to enhance overall industry competitiveness. Being recognized by international investors for our corporate climate change transparency highlights UMC's industry leading position in sustainable operations and further motivates us to establish and achieve higher CS goals."

UMC has participated in CDP since 2006, improving on its scores every year to achieve the only "A" grade among all Taiwanese semiconductor companies listed on CPLI for 2015. The company received this year's honor due to its continued excellence in climate change initiatives, green foundry development, active reduction in greenhouse gas emissions, energy conservation and carbon reduction. In addition to its CPLI listing, UMC has received the Enterprise Environmental Protection Award from the ROC Government for 13 consecutive years. Earlier this year, the company announced its "UMC Green 2020" goals, to further reduce water, energy, and waste by 10% over current levels by 2020, further demonstrating UMC's long-term commitment to sustainable environment.

Paul Dickinson, executive chairman and co-founder of CDP says: "As the world looks beyond the Paris climate change negotiations and prepares for a low carbon future, reliable information about how companies are responding to the transition will be ever more valuable.  For this reason we congratulate those businesses that have achieved a position on CDP's Climate Disclosure Leadership Index."

About UMC

UMC (NYSE: UMC, TWSE: 2303) is a leading global semiconductor foundry that provides advanced IC production for applications spanning every major sector of the electronics industry. UMC's robust foundry solutions enable chip designers to leverage the company's sophisticated technology and manufacturing, which include 28nm gate-last High-K/Metal Gate technology, ultra-low power platform processes specifically engineered for Internet of Things (IoT) applications and the highest-rated AEC-Q100 Grade-0 automotive industry manufacturing capabilities. UMC's 10 wafer fabs are located throughout Asia and are able to produce over 500,000 wafers per month. The company employs over 17,000 people worldwide, with offices in Taiwan, mainland China, Europe, Japan, Korea, Singapore, and the United States. UMC can be found on the web at http://www.umc.com.

Note from UMC Concerning Forward-Looking Statements

Some of the statements in the foregoing announcement are forward looking within the meaning of the U.S. Federal Securities laws, including statements about future outsourcing, wafer capacity, technologies, business relationships and market conditions. Investors are cautioned that actual events and results could differ materially from these statements as a result of a variety of factors, including conditions in the overall semiconductor market and economy; acceptance and demand for products from UMC; and technological and development risks. Further information regarding these and other risks is included in UMC's filings with the U.S. Securities and Exchange Commission, including its registration statements and reports on Forms F-1, F-3, F-6 and 20-F and 6-K, in each case as amended. UMC does not undertake any obligation to update any forward-looking statement as a result of new information, future events or otherwise, except as required under applicable law.

Editorial Contacts:

UMC
Richard Yu
886-2-2658-9168 ext. 16951
[email protected]

SOURCE United Microelectronics Corporation