Trident to Demonstrate the Industry's First Integrated 2D-to-3D Conversion at IFA Show

SUNNYVALE, Calif., Sept. 1 /PRNewswire/ -- At the IFA show this week in Berlin, Trident Microsystems, Inc. (Nasdaq: TRID), a leading provider of set-top box and TV semiconductor solutions, will be demonstrating the industry's first integrated 2D-to-3D conversion chipset that provides best-in-class 3D capabilities while also enabling a 3D TV to display the high volume of 2D content that exists today.  While most 3D TV manufacturers have been required to incorporate expensive ICs to handle the 2D-to-3D conversion, Trident has integrated this feature onto its PNX5130 chipset to reduce customers' 3D TV system cost, provide full flexibility for handling frame sequential and line interleaved 3D panels, and deliver the best picture quality through its halo-free MEMC and accurate 3D motion technology.

"By integrating the 2D-to-3D conversion feature directly onto our PN5130 chipset, Trident enables customers to deliver lower-cost 3D TVs that are capable of displaying the large volumes of 2D content in impressive 3D," said Dirk Wieberneit, senior vice president and general manager of the Trident TV Business unit.  "Given that the majority of today's TV content is in 2D, this is a critical feature for the top TV OEMs and we are proud to be the first chip manufacturer to provide this capability in PNX5130 frame rate converter products."

About the PNX5130 2D/3D Conversion Chipset

PNX5130 is a video post processor that applies Motion Accurate Picture Processing (MAPP) to TV signals. PNX5130 generates 120Hz and 240Hz display output with full MEMC.  In addition, 3D TV support and local dimming are available as options. The chip's 2D-to-3D conversion is a new feature that has been added to the PNX5130 to extend 3D TV support on line interleaved and frame sequential displays. The 2D to 3D conversion is content aware so that it will adapt to the specifics in the sequence to deliver optimal results.

Product Availability

The Trident PNX5130 chipset that incorporates the 2D-to-3D conversion feature is currently sampling to customers worldwide.  This chip is based on the original PNX5130 chipset that was launched in January 2010 and is currently designed into the products of leading TV manufacturers worldwide.

Forward-Looking Information

This press release contains forward-looking statements within the meaning of Section 27A of the Securities Act of 1933 and Section 21E of the Securities Exchange Act of 1934, and is subject to the safe harbor created by those sections. These forward-looking statements include, but are not limited to, statements about the demonstration of Trident's integrated 2D-to-3D conversion chipset. Investors are cautioned that any such forward-looking statements are not guarantees of future performance and involve risks and uncertainties, and there are important factors that could cause Trident's actual results to differ materially from those in the forward looking statements. These risks include, without limitation, that not all consumers may realize 3D TV system cost reductions and that other manufacturers may release a similar product that may offer similar attributes. The forward-looking statements included in this press release are made only as of the date of this press release; Trident does not undertake any obligation to publicly revise or update any such forward-looking statement to reflect events or circumstances that may arise after the statement was made. Investors are cautioned not to place undue reliance on forward-looking statements. Additional information concerning factors that could cause results to differ can be found in the Company's filings with the Securities and Exchange Commission, including the Company's most recently filed Reports on Form 8-K, Form 10-K and Form 10-Q, which are available at http://www.sec.gov.

About Trident Microsystems, Inc.

Trident Microsystems, Inc., with headquarters in Sunnyvale, California, is a leading force in the digital home entertainment market, delivering an extensive range of platform solutions that enhance the consumer experience in the Connected Home.  As one of the top-three semiconductor providers to both the TV and set-top box markets, Trident's solutions can be found in the products of leading OEMs and channel partners worldwide.  The company's extensive IP portfolio of more than 2,000 patents has been driving key innovations in image quality, 3D TV, low power consumption, and 45nm designs. For further information about Trident and its products, please consult the Company's web site: www.tridentmicro.com.

NOTE: Trident, the Trident logo, PNX5130 and MAPP are either trademarks or registered trademarks of Trident Microsystems in the United States and /or other countries.  All other trademarks are properties of their respective owners.

SOURCE Trident Microsystems, Inc.