Toshiba Expands ApP Lite™ Processor Family With New, Power-Efficient Devices For IoT Applications

Additions to TZ5000 processor series extend CPU and memory performance

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Toshiba America Electronic Components, Inc.

Apr 13, 2015, 09:00 ET

SAN JOSE, Calif., April 13, 2015 /PRNewswire/ -- Toshiba America Electronic Components, Inc. (TAEC)*, a committed leader that collaborates with technology companies to create breakthrough designs, today introduced the latest additions to its TZ5000 series of ApP Lite™ processors targeting the Internet of Things (IoT). Based on the ARM^® Cortex^®-A9 dual-core CPU, the TZ5010XBG, TZ5011XBG, TZ5021XBG and TZ5023XBG processors use Toshiba proprietary hardware-based technologies for power management and system integration, delivering the low power consumption necessary for IoT applications.

Toshiba has added four new products to its TZ5000 series of ApP Lite(TM) processors targeting the Internet of Things (IoT). The new processors are based on the ARM(R) Cortex(R)-A9 dual-core CPU, and deliver power management, memory and security features necessary for IoT applications.

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"As end-product developers' needs evolve, we are continuing to grow our ApP Lite processor family with new devices designed to accommodate these requirements," said Deepak Prakash, senior director of marketing, Logic LSI Business Unit, System LSI Group at TAEC. "These newest processors, which deliver high memory efficiency and robust security features, enable development of highly reliable and stable applications with an enhanced user experience compared to earlier devices in the series."

The TZ5010XBG and the TZ5011XBG application processors incorporate a built-in baseband for high-speed Wi-Fi^® 802.11ac, graphics and video engine. The new processors extend CPU performance, memory performance and temperature range compared to earlier products in the TZ5000 line, making them suitable for IoT products that require greater data capacity, and enabling them to be used in a broader range of applications.

The TZ5021XB and TZ5023XBG support LP-DDR2/3 memory, specialized low-power mode for mobile devices, and a small package size for IoT applications. Additionally, the TZ5023XBG has a low-power DSP, the Cadence^® Tensilica^®HiFi Mini, which executes voice, audio and sensor processing.

In addition, Toshiba has released a general-purpose reference board, Android™ and Yocto Linux^® (Yocto Project™) Software Development Kits (SDKs), and design guidelines for easy installation of the development environment.

Hardware-based power management technology makes it possible to enter into a low-power mode in microseconds and to transit to low-power mode more easily compared to significantly slower software-based power management technology. It reduces power consumption and contributes to better thermal dissipation for most applications.

The TZ5010XBG and TZ5011XBG processors each come in a 12mm x 13mm x 1.2mm ball-grid-array (BGA) package with 0.5mm pitch and feature HD (1080p) video at 60 frames per second (fps) with decode and a DDR3 x 32-bit DRAM running at 1866Mbps. The TZ5021XBG and TZ5023XBG each come in a 12mm x 12mm x 0.8mm package-on-package (PoP) with 0.5mm pitch. Video resolution is 1080p at 30fps with decode, and DRAM is LP-DDR2/3 x 32 bit running at 1333Mbps. All devices feature an Imagination PowerVR SGX540 GPU.

Availability
Samples of the four new ApP Lite processors are now available. Mass production is under way for the TZ5010XBG and TZ5011XBG, and will begin in June for the TZ5021XBG and TZ5023XBG.

ApP Lite is a trademark of Toshiba Corporation. ARM and Cortex are trademarks or registered trademarks of ARM Limited in the EU and other countries. Wi-Fi is a registered trademark of the Wi-Fi Alliance. Cadence and Tensilica are registered trademarks of Cadence Design Systems, Inc. Android is a trademark of Google, Inc. Linux is a registered trademark of Linus Torvalds in the U.S. and other countries. Yocto Project is a registered trademark of The Linux Foundation. Imagination Technologies, PowerVR and SGX are trademarks or registered trademarks of Imagination Technologies Ltd.

*About TAEC
Through proven commitment, lasting relationships and advanced, reliable electronic components, Toshiba enables its customers to create market-leading designs. Toshiba is the heartbeat within product breakthroughs from OEMs, ODMs, CMs, VARs, distributors and fabless chip companies worldwide. A committed electronic components leader, Toshiba designs and manufactures high-quality flash memory-based storage solutions, solid state drives (SSDs), hard disk drives (HDDs), solid state hybrid drives (SSHDs), discrete devices, custom SoCs/ASICs, imaging products, microcontrollers, wireless components, mobile peripheral devices, advanced materials and medical tubes that make possible today's leading smartphones, tablets, cameras, medical devices, automotive electronics, industrial applications, enterprise solutions and more.

Toshiba America Electronic Components, Inc. is an independent operating company owned by Toshiba America, Inc., a subsidiary of Toshiba Corporation, Japan's largest semiconductor manufacturer and the world's sixth largest semiconductor manufacturer (Gartner, 2014 Worldwide Semiconductor Revenue Estimates, December 2014). Founded in Tokyo in 1875, Toshiba is at the heart of a global network of over 590 consolidated companies employing over 200,000 people worldwide. Visit Toshiba's web site at www.toshiba.co.jp/index.htm.

© 2015 Toshiba America Electronic Components, Inc. All rights reserved.
Information in this press release, including product pricing and specifications, content of services and contact information, is current and believed to be accurate on the date of the announcement, but is subject to change without prior notice. Technical and application information contained here is subject to the most recent applicable Toshiba product specifications.

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MCA Public Relations	Toshiba America Electronic Components, Inc.
Tel.: (650) 968-8900, ext. 115	Tel.: (408) 526-2454
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