Texas Instruments' OMAP(TM) 4 technology delivers market-leading applications and uses cases that will change the way consumers 'watch' and 'interact' with their mobile devices

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Feb 15, 2010, 01:26 ET

BARCELONA, Spain, Feb. 15 /PRNewswire/ -- This week at Mobile World Congress, Texas Instruments Incorporated (TI) (NYSE: TXN) shared its vision for the mobile future, unveiling new use cases that will dramatically change how consumers "watch" and "interact" with mobile devices. Leading the next wave of mobile use cases will be a set of applications classified as Human Device Interactions (HDI). TI's OMAP™ 4 platform is uniquely positioned to make leading features such as multiple displays, projection technology and gesturing capabilities – features critical to supporting HDI use cases – a reality. In fact, TI expects the world's first "touchless gesture-recognition" and "3D-HD" (three-dimensional, high definition) mobile devices – enabled by TI's powerful OMAP 4 processor platform – to debut within the coming year. By simplifying common tasks and making the user interfaces more intuitive, these new capabilities will change how people capture and watch multimedia content, and how they interface with and control mobile devices. (For more information on how TI's OMAP platform will deliver the mobile future, visit: www.ti.com/omap4visionpr.)

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"TI envisions a near-term mobile future that will be vastly different than today's mobile environment," said Remi El-Ouazzane, vice president and general manager of TI's OMAP Platform Business Unit. "Similar to how the touchscreen changed the way we interact with our devices, touchless gesturing and 3D-HD mobile capabilities will take experiences to the next level and radically change how we connect to our devices and the things around us. TI is excited to play a key role with our customers in this revolution."

OMAP technology revolutionizes how people "interact," "watch" and "see" with mobile devices:

Sampling now, TI's OMAP 4 platform is the fourth generation of a proven, powerful system-on-chip that includes an optimal balance of power efficiency and high performance. This sophisticated architecture is the ideal platform for enabling this "mobile future." The OMAP 4 platform provides the optimal mix of interfaces, processing power and the flexibility required to address the computational complexity of algorithms required to support vision analytics and other HDI applications. For example, the OMAP 4 platform is the only mobile applications processor that can deliver stereoscopic 720p at 30 frames per second (fps) per channel or enable true 3D image capture, both crucial elements for delivering comprehensive "3D-HD" experiences. OMAP 4 enables many HDI scenarios including:

    
    
    Consumer
     application      How does it work      OMAP 4 platform uniquely delivers
    ------------      ----------------      ---------------------------------
    Touchless         Single, low-cost      --Gesture recognition software
     gesturing:       2D camera,              running on the industry-leading
     Gesture-         combined with           C6x-based DSP architecture,
     driven           object recognition      which improves performance,
     user             software, allows        reduces power and allows
     interface,       mobile devices to       concurrency with multiple
     whereby          track and               applications
     single or        recognize body,       --TI's powerful Image Signal  
     multiple         hand and finger         Processor (ISP), which provides
     finger           gestures                robustness to precisely 
     gestures                                 recognize gestures in low or 
     "in the                                  bright light conditions   
     air" can be                                     
     used as a                                   
     virtual                                  
     touch                                     
     screen                                   
                                     
    
    
    Multiple          Spreads content       --TI's feature-rich display
     display          across multiple         controller, supports three 
     support:         displays, or uses       high-resolution displays in 
     Multiple         multiple screens        parallel, each with its own 
     screens          to provide              unique content
     can be viewed    different                
     simultaneously,  dimensions of            
     allowing user    information              
     to view and          
     digest              
     information      
     at the              
     same time           
       
    
    Interactive      OMAP 4 processor       --Tight coupling with TI DLP(R)
     projection:     dynamically              Pico(TM) projector technology,
     User can        manipulates a            allowing for real time 
     "point          projected image          manipulation and interaction 
     and click"      and syncs it with        with the projected image 
     on projected    the on-device        
     images          camera                
    
    
    Stereoscopic     Integrating two        --Building on more than a decade
     3D imaging:     cameras on device,       of experience, TI's IVA3 imaging
     HD-quality      a mobile device          engine supports up to 720p 30fps
     3D capture      can perceive depth       stereoscopic 3D video record and
     and viewing     to generate              playback
                     stereoscopic 3D        --TI's best-in-class ISP also
                     images from the          supports stereoscopic 3D cameras
                     combination of         --The advanced display
                     right and left           controller from TI supports 
                     images, bringing a       auto-stereoscopic displays, 
                     "3D-HD"                  creating a 3D image without the 
                     experience to your       need for special headgear or
                     eyes and ears            glasses, as well as providing 
                                              support for external 3D 
                                              monitors
    
    
    Object            Devices will          --Flexible DSP supports vision
     recognition:     interpret specific      analytic software to aid in
     Enables          objects in the          visual recognition and data
     face, logo       pictures or             interpretation 
     and object       preview, providing    --Leveraging TI's proven ISP
     recognition      real-time relevant      allows access to integrated 
     captured         information on a        face detection hardware  
     by a             given object      
     mobile                
     device

(For more information on TI's OMAP 4 platform, visit: www.ti.com/omap4)

TI ecosystem in place to enable the "mobile future"

To realize this vision of the "mobile future", TI has partnered with key companies in its OMAP ecosystem. Visitors to Mobile World Congress can experience the following demonstrations in TI's booth (8A84, Hall 8):

Touchless gesturing running on the OMAP platform, which allows users to point, scroll and click "in the air" to control a graphical user interfaces (UIs)
An advanced 3D UI runs on multiple displays, showing how new interface capabilities will shape future device usage models
Dual displays show how enhanced mobile browsing experiences bring social media-like environments to consumers' pockets
Next-generation sensor input combined with visual and physical feedback to control mobile UI and displays in response to user-generated motion, touch input and pressure

About Texas Instruments

Texas Instruments (NYSE: TXN) helps customers solve problems and develop new electronics that make the world smarter, healthier, safer, greener and more fun. A global semiconductor company, TI innovates through manufacturing, design and sales operations in more than 30 countries. For more information, go to www.ti.com.

Trademarks

OMAP, NaviLink, WiLink, BlueLink and Pico are trademarks of Texas Instruments Inc. DLP is a registered trademark of Texas Instruments Inc. All other registered trademarks and trademarks belong to their respective owners.

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