Texas Instruments Delivers Industry's First Quad-Radio Single Chip
TI raises the bar with WiLink(TM) 7.0 solution, integrating WLAN, GPS, Bluetooth(R) and FM transmit/receive technologies on a true single-chip
DALLAS, Feb. 9 /PRNewswire/ -- Demonstrating its leadership in the wireless connectivity market, Texas Instruments Incorporated (TI) (NYSE: TXN) today unveiled its WiLink™ 7.0 single-chip solution, the industry's first offering to integrate WLAN 802.11n, GPS, FM transmit/receive and Bluetooth® technologies. Integrating these capabilities on a true single chip, the 65-nanometer WiLink 7.0 solution reduces costs by 30 percent, reduces size by 50 percent and delivers superior coexistence performance as compared to today's existing solutions. Built on seven generations of proven technologies and legacy software, this single-chip solution further extends TI's heritage of bringing technologies previously seen in high-end devices to the broad mobile market. The WiLink 7.0 solution will be showcased during Mobile World Congress 2010 in the TI booth (8A84, Hall 8). For more information, visit www.ti.com/wilink7pr.
To view the multimedia assets associated with this release, please click: http://multivu.prnewswire.com/mnr/ti/39150/
(Photo: http://www.newscom.com/cgi-bin/prnh/20100209/MM50621 )
"TI's announcement that its Bluetooth/FM/GPS/WLAN combination IC is sampling to major OEMs marks the first of its kind, demonstrating the strong future for combination ICs that enable device manufacturers to offer multiple radios without sacrificing performance, space requirements or profit margins," said Lisa Arrowsmith, analyst, IMS Research. "IMS Research forecasts that by 2013, more than 4.5 billion combination ICs featuring a variety of radios will have been shipped."
A one-chip wonder: WiLink 7.0 solution's unique features and benefits
Key feature Benefits ------------------------------------------------------------------------ Unique -- Hardware mechanisms cancel out board- and coexistence chip-level RF interference at the source to capabilities simplify design process -- Enhanced WiFi/Bluetooth/Bluetooth Low Energy inter-core communication prioritizes packet scheduling, supports more connections in parallel ------------------------------------------------------------------------ High-performance GPS core -- Best-in-class 3GPP test performance -- Multi-path resolution engine coupled with advanced algorithms reduces interference impact for more accurate positioning in urban canyons -- On-chip position engine simplifies integration with device host processor -- Supports reduced power consumption during tracking -- Host-independent location buffering and geo- fencing features further reduce host loading and power consumption ------------------------------------------------------------------------ Powerful Bluetooth core -- Best-in-class RF performance -- Dedicated audio processor system-on-chip -- Supports latest Bluetooth low-energy and Bluetooth 3.0 specifications -- Extensible to support additional protocols ------------------------------------------------------------------------ Robust Wi-Fi core -- Supports the soon-to be ratified WiFi Direct(TM) and Soft AP mode capabilities, extensible to support additional protocols -- Supports 802.11 a/b/g/n capabilities ------------------------------------------------------------------------ FM core -- Increased output power for FM transmit combined with highly sensitive FM receive delivers cleaner FM experience -- Supports internal antenna ------------------------------------------------------------------------
"As the first company to put the power of GPS, WLAN, Bluetooth and FM technologies on a single chip, we are excited to have solved some of the market's most complex coexistence challenges," said Haviv Ilan, vice president and general manager, wireless connectivity solutions, TI. "This type of innovation builds on our strong heritage in the wireless market and commitment to spearhead next-generation advancements. With its ability to support simultaneous use of all four radios, the WiLink 7.0 solution will truly revolutionize the way people interact with their devices and connect to the larger world."
Availability
The WiLink 7.0 solution is sampling to major OEMs today. Devices using the WiLink 7.0 solution are expected to enter the market by the end of 2010.
To learn more about TI's WiLink 7.0 solution, visit:
- Video: www.ti.com/wilink7videos
- Images: www.ti.com/wilink7images
- Block diagram: www.ti.com/wilink7blkdiagram
- Follow TI on Twitter: www.twitter.com/txinstruments
- TI Mobile Momentum blog: http://e2e.ti.com/blogs_/b/mobile_momentum/default.aspx
About Texas Instruments
Texas Instruments (NYSE: TXN) helps customers solve problems and develop new electronics that make the world smarter, healthier, safer, greener and more fun. A global semiconductor company, TI innovates through manufacturing, design and sales operations in more than 30 countries. For more information, go to www.ti.com.
Trademarks
WiLink™ is a trademark of Texas Instruments Inc. All other registered trademarks and trademarks belong to their respective owners.
TXN-P
SOURCE Texas Instruments Incorporated
WANT YOUR COMPANY'S NEWS FEATURED ON PRNEWSWIRE.COM?
Newsrooms &
Influencers
Digital Media
Outlets
Journalists
Opted In
Share this article