TechConnect, National Innovation, and SBIR/STTR Summit Announce Top Corporate Partners and Innovation Submission Deadline
TechConnect Innovation-to-Corporate Partnering Program accepting submissions through Friday, January 31st for review, showcase and presentation consideration.
WASHINGTON, Jan. 30, 2014 /PRNewswire/ -- TechConnect World and the National Innovation Summit & Showcase, co-located with the National SBIR/STTR Conference, will take place June 15-19 just outside Washington, D.C. at the Gaylord National Convention Center (www.nationalinnovationsummit.com). The combined events create the world's largest technology to commercialization event, attracting an audience of thousands of business, government, and academic leaders from around the world.
Top Corporate Partners for the 2014 TechConnect World and National Innovation Summit include BASF, Boeing, Bosch, Corning, Daikin-America, DuPont, Harris & Harris, Jabil, Lockheed Martin, LORD, MeadWestvaco (MWV), Merck, Momentive, Sabic, Saint Gobain, Shell, SK Innovation, and many more.
Entering its 16th year, TechConnect World and the National Innovation Summit combine to create the world's largest global conference and marketplace for innovators, corporate technology developers, and investors. TechConnect will once again host and co-locate with the National SBIR/STTR Conference, the largest SBIR/STTR event in the US. At the National SBIR/STTR Conference, attendees can connect one-on-one with all SBIR federal funding agencies and components, including the Department of Defense, Department of Energy, and National Institutes of Health.
"We are delighted with the corporate community prospecting innovation opportunities at the joint conferences in Washington D.C.," said Dr. Matthew Laudon, CEO of TechConnect. "These investment and corporate partners are true global leaders in innovation and we are looking forward to their participation this June."
Corporate & Investment Partners will also participate in the TechConnect-National Innovation Summit Corporate Acceleration program, which features pre-vetted innovations matched with corporate partners. Corporate business and research development teams will be on-site for one-on-one meetings with participating innovators and will also speak in the program.
Innovation Submissions are due Friday January 31 to be considered for presentation in the Corporate Matchmaking program.
To submit your Innovation, visit:
www.techconnectworld.com/World2014/participate/innovation/.
To learn more about the conferences and register to attend, visit:
www.nationalinnovationsummit.com/.
About TechConnect (www.techconnect.org):
TechConnect is a global technology outreach & development organization. Through our innovative programs and conferences, we deliver the most promising technologies to the world's top corporate, investment, and government professionals. TechConnect is headquartered in Austin, Texas, with offices in Cambridge, Massachusetts and Danville, California.
About the National Innovation Summit & Showcase (www.nationalinnovationsummit.com):
TechConnect presents the National Innovation Summit & Showcase, the nation's top innovations emerging from our federal technology funding programs. All showcasing innovations are vetted by our industry and investment review Committees, and all will participate the TechConnect Corporate Acceleration and Matchmaking Programs with our participating Corporate and Investment Partners.
Media Contact:
Jennifer Rocha, TechConnect
1-774-249-8514
SOURCE TechConnect
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