STMicroelectronics Adds Flexibility to ESD-Protection IC for Ultra High-Speed (UHS-I) micro-SD Card Slots
Fully integrated ESD and EMI protection IC supports SD 3.0 data speeds and memory capacities for better mobile user experiences
GENEVA, Oct. 21, 2011 /PRNewswire/ -- STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, has introduced a new IC combining EMI filtering and Electro-Static Discharge (ESD) protection, offering unique features for equipment such as mobile phones, tablets and 3G dongles using SD 3.0 Ultra High Speed (UHS-I) micro-SD cards.
By 2013 some 500 million mobile handsets could ship with a UHS-I compliant SD Card slot, based on figures from Strategy Analytics for slotted phones. UHS Class cards will provide up to 2 Terabytes of storage as well as offering high-speed performance to improve the user experience for tasks such as direct recording of high-definition video, playing back or sharing content, or backing up data.
The exposed connections in the card slot must have protection against an electro-static discharge, which can be caused simply by picking up the device and can damage the system's circuitry. However, EMI filters and ESD-protection ICs must be optimized for the specified interface speed to ensure full-speed communication between the system and the card. ST's new EMIF06-MSD03F3 protects micro-SD interfaces up to the specified UHS-I speed of 104 Megabytes per second.
The EMIF06-MSD03F3 features the most advanced, miniaturized package technology used for this type of device but, unlike competing products, allows either electrical or mechanical card-insertion detection. This frees designers to use the card detection method that best suits their application and host system. The device also has integrated pull-up resistors to guarantee system behavior when no card is inserted, and an EMI filter to block GSM interference.
Major features of EMIF06-MSD03F3:
- +/-15kV ESD protection meeting IEC 61000-4-2
- Protection for all SD Card data and power lines
- 7pF maximum load capacitance
- 16-bump, 0.4mm pitch chip-scale package (WLCSP)
- Tiny 1.54 x 1.54mm outline
- ST IPAD™ Integrated Passive and Active Device technology
The EMIF06-MSD03F3 is available in the 0.4mm-pitch WLCSP package, priced from $0.23 for orders over 1000 pieces. Alternative pricing options may be available for higher quantities.
About STMicroelectronics
STMicroelectronics is a global leader serving customers across the spectrum of electronics applications with innovative semiconductor solutions. ST aims to be the undisputed leader in multimedia convergence and power applications leveraging its vast array of technologies, design expertise and combination of intellectual property portfolio, strategic partnerships and manufacturing strength. In 2010, the Company's net revenues were $10.35 billion. Further information on ST can be found at www.st.com.
SOURCE STMicroelectronics
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