Record Date of Dividends, Membership of Alliance, Upcoming Investor Briefing, Collaborations, and Participation in Summits - Analyst Notes on TSMC, NXP, KLA-Tencor, AppliedMicro and Ultratech

NEW YORK, June 27, 2014 /PRNewswire/ --

Today, Analysts Review released its analysts' notes regarding Taiwan Semiconductor Mfg. Co. Ltd. (NYSE: TSM), NXP Semiconductors NV (NASDAQ: NXPI), KLA-Tencor Corporation (NASDAQ: KLAC), AppliedMicro Circuits Corporation (NASDAQ: AMCC) and Ultratech, Inc. (NASDAQ: UTEK). Private wealth members receive these notes ahead of publication. To reserve complementary membership, limited openings are available at: http://www.analystsreview.com/4188-100free.

Taiwan Semiconductor Mfg. Co. Ltd. Analyst Notes
On June 24, 2014, Taiwan Semiconductor Mfg. Co. Ltd. (TSMC) announced that July 20, 2014 will be record date for common stock shareholders who will be entitled to participate in the distribution of TSMC's 2013 profits in the form of cash dividend. The Company stated that as mandated by Article 165 of Taiwan's Company Law, the shareholders' registration will be closed for five days prior to the record date for registration transfer. TSMC informed that the ex-dividend date for TSMC American Depositary Shares (ADSs) is July 14, 2014, while the record date for TSMC ADSs entitled to participate in this cash distribution will be July 16, 2014. The full analyst notes on TSMC are available to download free of charge at:

http://www.analystsreview.com/Jun-27-2014/TSM/report.pdf

NXP Semiconductors NV Analyst Notes
On June 23, 2014, NXP Semiconductors NV (NXP) announced that it has joined the ZigBee Alliance Board of Directors, increasing its existing membership to 'Promoter' level. According to the Company, ZigBee Alliance is an open, non-profit association consisting of 400 organizations and promotes worldwide adoption of ZigBee's global wireless standards in wireless network communication devices. The Company informed that its extensive range of microcontrollers and transceivers for smart homes, as well as its newly developed platforms are based on ZigBee's standards. NXP stated that it joins Comcast Cable, Freescale Semiconductor, Inc., Itron Inc., Kroger, Landis+Gyr, Legrand Group, Philips Electronics, Schneider Electric, Silicon Labs, and Texas Instruments on the ZigBee Alliance Board of Directors. The full analyst notes on NXP are available to download free of charge at:

http://www.analystsreview.com/Jun-27-2014/NXPI/report.pdf

KLA-Tencor Corporation Analyst Notes
On June 19, 2014, KLA-Tencor Corporation (KLA-Tencor) announced that it will host its annual analyst briefing on July 8, 2014 at SEMICON West at W Hotel in San Francisco, California. According to the Company, its President and CEO Rick Wallace, and CFO Bren Higgins are slated to present from 12:30 p.m. PT until 2:00 p.m. PT. KLA-Tencor informed that a live webcast of the event will be available on the Company's Investor Relations site. The Company added that a replay of the webcast, as well as the presentation materials, will also be posted on the Company's website for 30 days following the webcast. The full analyst notes on KLA-Tencor are available to download free of charge at:

http://www.analystsreview.com/Jun-27-2014/KLAC/report.pdf

AppliedMicro Circuits Corporation Analyst Notes
On June 24, 2014, AppliedMicro Circuits Corporation (AppliedMicro) announced that Eurotech has teamed up with the Company and NVIDIA to develop a new, high performance computing (HPC) system architecture that combines density and energy efficiency. According to the Company, to create the new architecture Eurotech will utilize AppliedMicro's X-Gene TM, the world's first ARMv8 64-bit-based server on a chip solution, and paired the X-Gene with NVIDIA's Tesla GPU accelerators to deliver high performance for demanding workloads. The Company stated that the new architecture is based on a scalable packaging concept that enables an innovative way of packaging electronics and water cooling. Gaurav Singh, Vice President of Technology Strategy at AppliedMicro, said, "We are excited to collaborate with Eurotech and NVIDIA to commercialize this innovative, high performance platform." The full analyst notes on AppliedMicro are available to download free of charge at:

http://www.analystsreview.com/Jun-27-2014/AMCC/report.pdf

Ultratech, Inc. Analyst Notes
On June 24, 2014, Ultratech, Inc. (Ultratech) announced its participation in the 6th Annual CEO Investor Summit on July 9, 2014 in San Francisco, California. According to the Company, the CEO Summit is an accredited investor and publishing research analyst event held concurrently with SEMICON West and Intersolar 2014 in San Francisco. The Company added that the summit will be hosted by executive managements from participating companies, and will feature round-robin format, which consists of small group meetings, with each session lasting 30 minutes. The full analyst notes on Ultratech are available to download free of charge at:

http://www.analystsreview.com/Jun-27-2014/UTEK/report.pdf

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