Portfolio Expansions, Product Enhancements, New Solutions, Recent Collaborations, and Upcoming Earnings - Analyst Notes on Camtek, Lam Research, Teradyne, Synopsys and Ultratech

NEW YORK, July 10, 2014 /PRNewswire/ --

Today, Analysts Review released its analysts' notes regarding Camtek Ltd. (NASDAQ: CAMT), Lam Research Corporation (NASDAQ: LRCX), Teradyne, Inc. (NYSE: TER), Synopsys, Inc. (NASDAQ: SNPS) and Ultratech, Inc. (NASDAQ: UTEK). Private wealth members receive these notes ahead of publication. To reserve complementary membership, limited openings are available at: http://www.analystsreview.com/4620-100free.

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Camtek Ltd. Analyst Notes
On July 7, 2014, Camtek Ltd. (Camtek) announced the launch of its next generation Semiconductor Inspection and Metrology platform. The Company informed that the Eagle product line aims to support the fast growing Advanced Packaging market using cutting edge technologies, both software and hardware, that deliver unparalleled 2D and 3D inspection and metrology capabilities on the same platform. "This new product line will strengthen our leading position in the Semiconductor backend market, taking advantage of our expertise in bump inspection and metrology. The Advanced Packaging market in particular uses a wide spectrum of bump types and sizes. Our outstanding capabilities in the inspection and metrology of current and next-generation bumps, down to 2µm, will give our customers a competitive edge in this emerging market," commented Ramy Langer, Vice President and Head of Semiconductor Division at Camtek. The full analyst notes on Camtek are available to download free of charge at:

http://www.analystsreview.com/Jul-10-2014/CAMT/report.pdf

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Lam Research Corporation Analyst Notes
On July 7, 2014, Lam Research Corporation (Lam Research) announced the addition of atomic layer etch (ALE) to the Company's portfolio of atomic layer deposition (ALD) products. The Company informed that the new production-worthy ALE capability on the 2300 Kiyo F Series conductor etch system delivers atomic-scale variability control, enabling next-generation wafer processing. "As the industry continues to aggressively scale device dimensions, new methods of manufacturing are needed -- particularly for the etch and deposition processes that will create those features," said Dave Hemker, Senior Vice President and Chief Technology Officer at Lam Research. "Through continuous innovation, we are meeting those needs with new atomic-scale processing capabilities that provide chipmakers with advanced technology, process control, and productivity that enable next-generation device manufacturing." The full analyst notes on Lam Research are available to download free of charge at:

http://www.analystsreview.com/Jul-10-2014/LRCX/report.pdf

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Teradyne, Inc. Analyst Notes
On July 7, 2014, Teradyne, Inc. (Teradyne) introduced its latest wireless test solution for the UltraFLEX test platform. The Company stated that this release expands its market-leading position by introducing a new RF instrument, the UltraWave24; a new DSP Processor, the UltraDSP1; and the latest version of the Enhanced Signal Analyzer (ESA) Toolkit. Teradyne informed that it has already received orders from several customers for the next generation wireless test solution. "The combination of the UltraWave24 instrument, UltraDSP1 computer, and ESA Toolkit builds on the strong position that the UltraFLEX has achieved in the test of leading edge LTE Advanced transceivers and 802.11ac radios," said Stephen Pruitt, RF Segment Manager at Teradyne. "The continued expansion of the LTE-A and 802.11ac standards require production test equipment with bench level measurement performance and the infrastructure to handle the enormous amounts of measurement data. The UltraFLEX Wireless Test Solution provides the solution to that challenge." The full analyst notes on Teradyne are available to download free of charge at:

http://www.analystsreview.com/Jul-10-2014/TER/report.pdf

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Synopsys, Inc. Analyst Notes
On June 30, 2014, Synopsys, Inc. (Synopsys) along with the Indian Institute of Technology, Bombay (IIT Bombay) announced a collaboration to advance the modeling of negative bias temperature instability (NBTI) - a key reliability concern for advanced CMOS devices. The Company expects the collaboration to enable leading semiconductor manufacturers to gain insight into the NBTI degradation and develop methods to mitigate its effects on FinFETs at the 14nm node and beyond. In addition, the collaboration also enables IIT Bombay to conduct experiments and measurements to characterize NBTI in FinFET devices. The full analyst notes on Synopsys are available to download free of charge at:

http://www.analystsreview.com/Jul-10-2014/SNPS/report.pdf

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Ultratech, Inc. Analyst Notes
On July 1, 2014, Ultratech, Inc. (Ultratech) announced that it intends to release its Q2 2014 earnings results on July 17, 2014, before the market opens. On the same day, the Company has scheduled an earnings conference call at 8:00 a.m. PT/11:00 a.m. ET, which will be hosted by Ultratech's Chairman and CEO Arthur W. Zafiropoulo, and Senior Vice President and CFO Bruce Wright. The full analyst notes on Ultratech are available to download free of charge at:

http://www.analystsreview.com/Jul-10-2014/UTEK/report.pdf

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