Polymeric Materials for 3DIC & WLP Applications

NEW YORK, June 4, 2012 /PRNewswire/ -- Reportlinker.com announces that a new market research report is available in its catalogue:

Polymeric Materials for 3DIC & WLP Applications

http://www.reportlinker.com/p0874332/Polymeric-Materials-for-3DIC--WLP-Applications.html#utm_source=prnewswire&utm_medium=pr&utm_campaign=Plastic

The first complete report analyzing in detail the  opportunities for Polymeric Materials in 3DIC & Wafer-Level Packaging applications

POLYMER USAGE WILL GROW BY 26% CAGR IN WAFER LEVEL APPLICATIONS OVER 5 YEARS

Polymeric semiconductor material market reached a value of $274M last year and its growth over the next 5 years of more than 26% CAGR will be fueled by the expansion of flip-chip wafer bumping, Fan-in WLCSP packages, 3D WLP, FO WLP packages, 2.5D Glass / Silicon interposers and 3DIC  packages.

Yole analysts have gathered market data, technology information and analysis necessary to answer the following questions:

What materials are being used in what applications ?What key properties do I need to understand before I make a material choice ?Who are the key supplies of these materials  and what is their market share?What synergies do competitors have in their product lines ? 

AN INCREASING NUMBER OF POLYMERS ARE USED FOR WLP APPLICATIONS  $107M

Polymide (PI) and BCB of DOW Chemical still account for > 70% of the total demand, historically by the growth flip-chip bumping an WLCSP passivation steps. 

PBO, epoxies, WPR and AL-X recently entered the market thanks to the recent growth demand in 300mm WLCSP, FOWLP and emerging 3DIC applications.

This research will cover :Global materials market forecastGlobal forecast  breakdown by applicationGlobal forecast  breakdown by functionDetailed market breakdown of permanent dielectrics by material, supplier, account 

A WIDE RANGE OF POLYMERIC MATERIALS ARE USED TO SOLVE WLP ISSUES

Chemistries  and history of key microelectronic polymers

Properties, pros & cons for each solution

Applications by polymer type

Processing considerations

 NEW FUNCTIONS OF POLYMERIC MATERIALS ARE LEVERAGING BURGEONING WLP MARKET

Types of polymeric materials covered:Permanent dielectric polymersThick plating resistsTemporary bonding & de-bonding adhesivesHard mask resist for DRIE etchWafer-level underfillsWafer-level molding compoundsAdhesive tape (BG/Dicing tape) 

DETAILED MATERIAL SUPPLIER PROFILES Asahi Glass Nitto Denko

WHO SHOULD BUY THIS REPORT?

*Material suppliers Assess the TAM ( total accessible market) for your company's polymeric productsIdentify tech trends, challenges and requirements for each 3DIC / WLP scenarios. Are their markets you could be serving?*Materials users (IDMs,  Wafer Foundries, Packaging Houses)Identify competitive materials, What are others using ?Consolidate suppliers by understanding their full product offerings*Equipment Vendors  What materials should you be developing processes for ?What are the technology trends ? 

Table of Contents

Executive summary p.10

Key Properties of Polymeric materials p.22-6

Electrical properties

Mechanical Properties

Thermal Properties

Others Properties

Comparison of Polymer  Properties

Commercial Microelectronic Polymer Chemistries p.62

Epoxies

Polyimides

Polybenzoxozoles (PBO)

BCB

Siloxanes   

Parylène   

Polynorbornenes

AL-X aromatic fluoropolymer

Polymeric materials for Wafer Level Packaging Functions Applications p.111

Permanent dielectric polymers

Strippable plating resists   

Temporary bonding & de-bonding  Adhesives

Hard mask Thick resist for DRIE

Wafer-level underfills

Wafer-level Molding Compounds

Permanent Dielectric -Material Processing Considerations p.199

Wafer-level Molding Compounds

Spin-coating

Spray-coating

Other depositions

Lithography (Expose & Develop)

Curing / Descum

Stripping/cleaning

Mid-End / WLP Application platforms p.237

Flip-chip wafer bumping

'Fan-in' WL CSP

FO WLP

3D WLP

3D IC with TSV

2.5 silicon interposers

Passive Integration – Thin-film IPD

Market size by Material / Application/Supply chain p.280

WLP Materials market forecast for WLP applications

2011-2016 Global Materials Market Forecast

2011-2016 Global Materials market forecast breakdown

2010-2016 Polymer materials forecast breakdown by materials functions

Dielectric passivation polymers: details market forecast

WLP cost breakdown per material supplier 2011

WLP cost breakdown by polymer type 2011

Polymer market share per supplier

Demand by player breakdown by application per player

Polymeric material suppliers – Company  profiles p.321

Conclusions & Perspectives 

Appendix p.439

To order this report:Plastic Industry: Polymeric Materials for 3DIC & WLP Applications

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