Microsemi Participates in New Research Project to Reduce CO Emissions

ALISO VIEJO, Calif., Feb. 7, 2012 /PRNewswire/ -- Microsemi Corporation (Nasdaq: MSCC), a leading provider of semiconductor solutions differentiated by power, security, reliability and performance, today announced its participation in a multi-disciplinary consortium tasked with developing innovative CMOS-compatible, high-temperature sensors that help reduce carbon emissions and drive energy consumption savings. The European Union's Seventh Framework Programme (FP7ICT) is funding the majority of the SOI-HITS (Silicon on Insulator High Temperature Systems) project, which is slated for completion by the end of August 2014.

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Microsemi will lead and manage the SOI-HITS project, and be responsible for high-temperature packaging and system integration activities.  Additional consortium members include:

• Cambridge CMOS Sensors, a spin out SME, will exploit the 'revolutionary' smart technology for gas sensors developed by the Universities of Cambridge and Warwick;
• Cambridge University, a world renowned body, will provide overall scientific coordination and technical leadership for the nano sensor design and fabrication within harsh environments;
• Cissoid, a leader in high-temperature semiconductor solutions, will design a high-temperature, highly integrated, intelligent interface circuit for the gas sensor;
• Honeywell Romania will be responsible for the demonstrator design and testing; will oversee the exploitation activities of the project; will be involved in gas sensors design and fabrication, and in the numerical simulation of the sensors and sensing system developed within the project;
• IREC will be responsible for scientific research related to gas sensing structures, design, numerical simulations, test structure fabrication and sensing layer selection;
• Universite Catholique de Louvain will design and test a water vapour concentration sensor, a UV photodiode and associated interface electronic circuits, for high temperature operation;
• Warwick University, a world renowned Microsensors & Bioelectronics Laboratory (formerly Sensors Research Laboratory), will be responsible for the characterization and testing of the gas sensors under harsh environmental conditions.

About the Project

For this project, SOI-HITS will develop sensors with a built-in electronic interface designed to work in harsh high-temperature environments, something that is difficult to achieve at the present time due to the limits of conventional sensor and control electronics and packaging.

The development of a high-temperature SIP (system in a package) will enable real-world technology demonstrators with the capability of on-chip processing electronics, including drive circuitry, filters, amplifiers, processing circuits and analog to digital interfaces, operating at 225 degrees centigrade.

The extension of the platform to optical detectors, such as ultra-violet (UV) photodiode flame detectors and infrared (IR) combined sources/detectors, will also be explored. 

About Microsemi
Microsemi Corporation (Nasdaq: MSCC) offers a comprehensive portfolio of semiconductor solutions for: aerospace, defense and security; enterprise and communications; and medical, alternative energy and industrial markets. Products include high-performance, high-reliability analog and RF devices, mixed-signal and RF ICs, ultra low-power radios, customizable SoCs, FPGAs and complete subsystems. Microsemi is headquartered in Aliso Viejo, Calif., and has approximately 3,000 employees globally. Learn more at www.microsemi.com.

Microsemi and the Microsemi logo are registered trademarks or service marks of Microsemi Corporation and/or its affiliates. Third-party trademarks and service marks mentioned herein are the property of their respective owners.

"Safe Harbor" Statement under the Private Securities Litigation Reform Act of 1995: Any statements set forth in this news release that are not entirely historical and factual in nature, including without limitation statements related to the SOI-HITS project, and its potential effects on future business, are forward-looking statements. These forward-looking statements are based on our current expectations and are inherently subject to risks and uncertainties that could cause actual results to differ materially from those expressed in the forward-looking statements. The potential risks and uncertainties include, but are not limited to, such factors as rapidly changing technology and product obsolescence, potential cost increases, variations in customer order preferences, weakness or competitive pricing environment of the marketplace, uncertain demand for and acceptance of the company's products, adverse circumstances in any of our end markets, results of in-process or planned development or marketing and promotional campaigns, difficulties foreseeing future demand, potential non-realization of expected orders or non-realization of backlog, product returns, product liability, and other potential unexpected business and economic conditions or adverse changes in current or expected industry conditions, difficulties and costs of protecting patents and other proprietary rights, inventory obsolescence and difficulties regarding customer qualification of products. In addition to these factors and any other factors mentioned elsewhere in this news release, the reader should refer as well to the factors, uncertainties or risks identified in the company's most recent Form 10-K and all subsequent Form 10-Q reports filed by Microsemi with the SEC. Additional risk factors may be identified from time to time in Microsemi's future filings. The forward-looking statements included in this release speak only as of the date hereof, and Microsemi does not undertake any obligation to update these forward-looking statements to reflect subsequent events or circumstances.

SOURCE Microsemi Corporation

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