Microsemi Introduces Industry's Smallest Hermetic Surface Mount Package for Transistors and Diodes

ALISO VIEJO, Calif., Oct. 6, 2011 /PRNewswire/ -- Microsemi Corporation (Nasdaq: MSCC), a leading provider of semiconductor solutions differentiated by power, security, reliability and performance, today introduced the industry's smallest hermetic surface mount package for power transistors and diodes. Microsemi pioneered the development of the new industry-standard U4 package, which has achieved Defense Logistics Agency (DLA) qualification for a range of products. The devices assembled as vehicles for this package qualification included medium power NPN and PNP bipolar transistors. Microsemi will also pursue qualifications for additional device types to support customer-specific requirements.

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The compact U4 is 70 percent smaller than its U3 predecessor and available now exclusively from Microsemi. The package is constructed with aluminum nitride ceramic, which provides excellent heat dissipation. This is particularly important for small products such as power supplies, converters and regulators which operate at high current rates that can cause overheating issues.  

"Microsemi created the hermetic U4 package to provide defense contractors with a rugged surface mount packaging solution for space-constrained products used in military environments," said Simon Wainwright, vice president of Marketing and Business Development for Microsemi's HiRel Group. "We have been serving the defense sector for more than 50 years, and will continue to build on our track record of innovating solutions for applications where exceptional performance and reliability are vital."

The U4 has a typical power rating of 5W-15W (@ Tc=25C) and is the smallest, hermetic surface mount package in its power category. Packaged parts are compatible with current pick-and-place assembly processes and are offered in tape-and-reel format.  

About Microsemi

Microsemi Corporation (Nasdaq: MSCC) offers a comprehensive portfolio of semiconductor solutions for: aerospace, defense and security; enterprise and communications; and industrial and alternative energy markets. Products include high-performance, high-reliability analog and RF devices, mixed-signal and RF integrated circuits, customizable SoCs, FPGAs, and complete subsystems. Microsemi is headquartered in Aliso Viejo, Calif., and has more than 2,700 employees globally. Learn more at www.microsemi.com.

Microsemi and the Microsemi logo are registered trademarks or service marks of Microsemi Corporation and/or its affiliates. Third-party trademarks and service marks mentioned herein are the property of their respective owners.

"Safe Harbor" Statement under the Private Securities Litigation Reform Act of 1995: Any statements set forth in this news release that are not entirely historical and factual in nature, including without limitation statements related to introducing its new U4 package and its potential effects on future business, are forward-looking statements. These forward-looking statements are based on our current expectations and are inherently subject to risks and uncertainties that could cause actual results to differ materially from those expressed in the forward-looking statements. The potential risks and uncertainties include, but are not limited to, such factors as rapidly changing technology and product obsolescence, potential cost increases, variations in customer order preferences, weakness or competitive pricing environment of the marketplace, uncertain demand for and acceptance of the company's products, adverse circumstances in any of our end markets, results of in-process or planned development or marketing and promotional campaigns, difficulties foreseeing future demand, potential non-realization of expected orders or non-realization of backlog, product returns, product liability, and other potential unexpected business and economic conditions or adverse changes in current or expected industry conditions, difficulties and costs of protecting patents and other proprietary rights, inventory obsolescence and difficulties regarding customer qualification of products. In addition to these factors and any other factors mentioned elsewhere in this news release, the reader should refer as well to the factors, uncertainties or risks identified in the company's most recent Form 10-K and all subsequent Form 10-Q reports filed by Microsemi with the SEC. Additional risk factors may be identified from time to time in Microsemi's future filings. The forward-looking statements included in this release speak only as of the date hereof, and Microsemi does not undertake any obligation to update these forward-looking statements to reflect subsequent events or circumstances.

SOURCE Microsemi Corporation

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