Microsemi High Temperature Flash Memory Products Withstand Environmental Challenges of Deeper Oil and Gas Drilling

ALISO VIEJO, Calif., March 21, 2013 /PRNewswire/ -- Microsemi Corporation (Nasdaq: MSCC), a leading provider of semiconductor solutions differentiated by power, security, reliability and performance, today announced its launch of high temperature flash memory products, tailored to meet the environmental demands of oil and gas industries' downhole drilling. The new high-temperature NOR flash products are designed for temperatures of 150°C and higher, and provide improved endurance benefits to systems designers. They can withstand the temperature, shock and vibration challenges encountered by drilling equipment thousands of feet below the surface.

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"Our company has been providing high-reliability microelectronics for decades," said BJ Heggli, vice president of strategic development and assistant general manager for Microsemi. "We understand the importance of high-reliability operation under tough conditions, which is why our products are subjected to stringent design, characterization and testing processes. Our company has unique capabilities to address the increased needs for higher density and temperature and we are excited about the launch of the first of several downhole product offerings."

The oil and gas industries are increasingly turning to unexplored areas as conventional sources of oil and gas decline. The high temperatures and pressures often found in these areas present complex challenges to the microelectronics used on drilling equipment. A substantial percentage of breakdowns in downhole systems is caused by failures in the electronics.

About High Temperature Flash
The new NOR flash product line is available in hermetic ceramic dual inline (DIP) small outline J-lead, (SOJ), flatpacks, ceramic quad flat pack (CQFP), or pin grid array (PGA) packages, and in 1 megabit (Mb), 4Mb and 16Mb densities.

Microsemi has full design, manufacture and test capabilities for a wide variety of Multiple Chip Packages (MCPs), commercial-off-the-shelf (COTS) memory, microprocessors and combination MCPs for demanding applications. These microelectronic products can also be customized for special requirements. For more information, call 602-437-1520.

About Microsemi
Microsemi Corporation (Nasdaq: MSCC) offers a comprehensive portfolio of semiconductor and system solutions for communications, defense & security, aerospace and industrial markets. Products include high-performance, radiation-hardened and highly reliable analog mixed-signal integrated circuits, FPGAs, SoCs and ASICs; power management products; timing and voice processing devices; RF solutions; discrete components; security technologies and scalable anti-tamper products; Power-over-Ethernet ICs and midspans; as well as custom design capabilities and services. Microsemi is headquartered in Aliso Viejo, Calif., and has approximately 3,000 employees globally. Learn more at www.microsemi.com.

Microsemi and the Microsemi logo are registered trademarks or service marks of Microsemi Corporation and/or its affiliates. Third-party trademarks and service marks mentioned herein are the property of their respective owners.

"Safe Harbor" Statement under the Private Securities Litigation Reform Act of 1995: Any statements set forth in this news release that are not entirely historical and factual in nature, including without limitation statements related to its new NOR flash products, and its potential effects on future business, are forward-looking statements. These forward-looking statements are based on our current expectations and are inherently subject to risks and uncertainties that could cause actual results to differ materially from those expressed in the forward-looking statements. The potential risks and uncertainties include, but are not limited to, such factors as rapidly changing technology and product obsolescence, potential cost increases, variations in customer order preferences, weakness or competitive pricing environment of the marketplace, uncertain demand for and acceptance of the company's products, adverse circumstances in any of our end markets, results of in-process or planned development or marketing and promotional campaigns, difficulties foreseeing future demand, potential non-realization of expected orders or non-realization of backlog, product returns, product liability, and other potential unexpected business and economic conditions or adverse changes in current or expected industry conditions, difficulties and costs of protecting patents and other proprietary rights, inventory obsolescence and difficulties regarding customer qualification of products. In addition to these factors and any other factors mentioned elsewhere in this news release, the reader should refer as well to the factors, uncertainties or risks identified in the company's most recent Form 10-K and all subsequent Form 10-Q reports filed by Microsemi with the SEC. Additional risk factors may be identified from time to time in Microsemi's future filings. The forward-looking statements included in this release speak only as of the date hereof, and Microsemi does not undertake any obligation to update these forward-looking statements to reflect subsequent events or circumstances.

MSCCP

SOURCE Microsemi Corporation

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