Microsemi Delivers Complete, Space-Saving SATA Storage Systems for Secure Defense and Aerospace Applications

ALISO VIEJO, Calif., Sept. 29, 2011 /PRNewswire/ -- Microsemi Corporation (Nasdaq: MSCC), a leading provider of semiconductor solutions differentiated by power, security, reliability and performance, today launched the first in a family of complete SATA storage systems for secure embedded defense applications. The compact MSM37 and MSM75 solutions are each packaged as a single 32mm x 28mm 522 PBGA (plastic ball grid array) and provide up to 75 gigabytes (GB) of NAND flash solid state storage. The combination of these features makes the devices ideal for applications where a full-size 2.5 inch storage device is too large.  

(Logo: http://photos.prnewswire.com/prnh/20110909/MM66070LOGO)

Advanced security features include AES-128 encryption, self-destruct capability and whole-module erase with "push-button" trigger option, which are essential for mission-critical defense and aerospace applications, ruggedized mobile systems, surveillance, avionics, navigation and ruggedized portable storage solutions.

"Our ability to miniaturize microelectronics systems has proven to be a key advantage in defense applications where SWaP solutions are critical," said Jack Bogdanski, director of marketing for Microsemi. "Offering a complete solid state storage system in a compact module allows designers to add more features to their systems, while supporting key security features that are increasingly important to our defense and aerospace customers."

The BGA package, available in 37 and 75 GB densities, combines a SATA flash controller with the latest in small geometry single line cell (SLC) NAND flash. The device includes a single supply with extended hold-up time without super caps or batteries. The BGA saves up to 60 percent board space when compared with a similar PCB design.

Key Features

• Density – 37 and 75 GB
• Host interface – 1.5 Gb/s and 3 Gb/s SATA
• Measures only 32mm x 28mm
• Available in a 522 PBGA package
• Offers 60 percent space savings as compared to PCB solutions with similar capabilities
• Lead or RoHS balls
• AES-128 encryption running CTR mode
• Self-destruct capability
• Power interruption protection
• Support for military sanitization protocols
• No batteries or super capacitors

Microsemi has full design, manufacture and test capabilities for a wide variety of multiple component packages (MCPs), commercial-off-the-shelf (COTS) memory, processors and combination MCPs for demanding applications. These microelectronic products can also be ruggedized and processed for tamper resistance. All devices are subjected to extensive environmental and temperature testing.  

Microsemi's facility in Phoenix, Ariz. is a DOD Trusted Source and DMEA accredited for assembly and test. Its quality and inspection system requirements are certified to MIL-PRF-38534 Class H and K, MIL-PRF-38535 Class B, ISO 9001:2008 and AS9100. For more information, call 602-437-1520.

About Microsemi

Microsemi Corporation (Nasdaq: MSCC) offers a comprehensive portfolio of semiconductor solutions for: aerospace, defense and security; enterprise and communications; and industrial and alternative energy markets. Products include high-performance, high-reliability analog and RF devices, mixed-signal and RF integrated circuits, customizable SoCs, FPGAs, and complete subsystems. Microsemi is headquartered in Aliso Viejo, Calif., and has more than 2,700 employees globally. Learn more at www.microsemi.com.

Editor's Note: Photo available upon request.

Microsemi and the Microsemi logo are registered trademarks or service marks of Microsemi Corporation and/or its affiliates. Third-party trademarks and service marks mentioned herein are the property of their respective owners.

"Safe Harbor" Statement under the Private Securities Litigation Reform Act of 1995: Any statements set forth in this news release that are not entirely historical and factual in nature, including without limitation statements related to its new SATA storage system, and its potential effects on future business, are forward-looking statements. These forward-looking statements are based on our current expectations and are inherently subject to risks and uncertainties that could cause actual results to differ materially from those expressed in the forward-looking statements. The potential risks and uncertainties include, but are not limited to, such factors as rapidly changing technology and product obsolescence, potential cost increases, variations in customer order preferences, weakness or competitive pricing environment of the marketplace, uncertain demand for and acceptance of the company's products, adverse circumstances in any of our end markets, results of in-process or planned development or marketing and promotional campaigns, difficulties foreseeing future demand, potential non-realization of expected orders or non-realization of backlog, product returns, product liability, and other potential unexpected business and economic conditions or adverse changes in current or expected industry conditions, difficulties and costs of protecting patents and other proprietary rights, inventory obsolescence and difficulties regarding customer qualification of products. In addition to these factors and any other factors mentioned elsewhere in this news release, the reader should refer as well to the factors, uncertainties or risks identified in the company's most recent Form 10-K and all subsequent Form 10-Q reports filed by Microsemi with the SEC. Additional risk factors may be identified from time to time in Microsemi's future filings. The forward-looking statements included in this release speak only as of the date hereof, and Microsemi does not undertake any obligation to update these forward-looking statements to reflect subsequent events or circumstances.

SOURCE Microsemi Corporation

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