Microsemi Adds Multiple New Devices to Non-Punch Through (NPT) IGBT Product Family

ALISO VIEJO, Calif., March 14, 2013 /PRNewswire/ -- Microsemi Corporation (Nasdaq: MSCC), a leading provider of semiconductor solutions differentiated by power, security, reliability and performance, today announced the availability of more than a dozen new devices in its new generation of 1200 volt (V) non-punch through (NPT) IGBTs which include 25A, 50A and 70A current ratings.

(Logo: http://photos.prnewswire.com/prnh/20110909/MM66070LOGO)

Microsemi's NPT IGBT product family is designed for a wide range of industrial applications requiring high power and high performance, with the newest devices well-suited for arc welders, solar inverters, and uninterruptible and switch mode power supplies. All of the devices in this 1200V product family are based on Microsemi's advanced Power MOS 8^™ technology, which enables a significant reduction of at least 20 percent in total switching and conduction losses as compared to competitive solutions.

Consistent with all devices in the product family, Microsemi's new NPT IGBT solutions can be packaged with Microsemi's FREDs or silicon carbide Schottky diodes to provide engineers with a highly integrated solution that allows them to streamline product development efforts. Additional features include:

• Significantly lower gate charge than similar devices, allowing faster switching;
• Hard switching operation greater than 80 kilohertz to enable efficient power conversion;
• Easy to parallel (positive temperature coefficient of Vcesat) to improve reliability in high power applications; and
• Short Circuit Withstand Time Rated (SCWT), providing reliable operation in applications requiring short circuit capability.

In addition to the benefits of the device, Microsemi offers NPT IGBTs in a large surface mount backside solderable D³ package, allowing designers to achieve increased power density and lower manufacturing costs.

Packaging and Availability
Microsemi's 1200V NPT IGBT product family now consists of over 20 devices with current ratings of 25A, 40A, 50A, 70A and 85A. The IGBT products are available in D³, TO-247, T-MAX, TO-264 and SOT-227 packages.

The new devices are in production now. For more information, or to obtain a sample, please email [email protected] or contact your local distributor or Microsemi sales representative.

About Microsemi
Microsemi Corporation (Nasdaq: MSCC) offers a comprehensive portfolio of semiconductor and system solutions for communications, defense & security, aerospace and industrial markets. Products include high-performance, radiation-hardened and highly reliable analog mixed-signal integrated circuits, FPGAs, SoCs and ASICs; power management products; timing and voice processing devices; RF solutions; discrete components; security technologies and scalable anti-tamper products; Power-over-Ethernet ICs and midspans; as well as custom design capabilities and services. Microsemi is headquartered in Aliso Viejo, Calif., and has approximately 3,000 employees globally. Learn more at www.microsemi.com.

Microsemi and the Microsemi logo are registered trademarks or service marks of Microsemi Corporation and/or its affiliates. Third-party trademarks and service marks mentioned herein are the property of their respective owners.

"Safe Harbor" Statement under the Private Securities Litigation Reform Act of 1995: Any statements set forth in this news release that are not entirely historical and factual in nature, including without limitation statements related to new devices in its new generation of 1200 volt non-punch through IGBTs, and its potential effects on future business, are forward-looking statements. These forward-looking statements are based on our current expectations and are inherently subject to risks and uncertainties that could cause actual results to differ materially from those expressed in the forward-looking statements. The potential risks and uncertainties include, but are not limited to, such factors as rapidly changing technology and product obsolescence, potential cost increases, variations in customer order preferences, weakness or competitive pricing environment of the marketplace, uncertain demand for and acceptance of the company's products, adverse circumstances in any of our end markets, results of in-process or planned development or marketing and promotional campaigns, difficulties foreseeing future demand, potential non-realization of expected orders or non-realization of backlog, product returns, product liability, and other potential unexpected business and economic conditions or adverse changes in current or expected industry conditions, difficulties and costs of protecting patents and other proprietary rights, inventory obsolescence and difficulties regarding customer qualification of products. In addition to these factors and any other factors mentioned elsewhere in this news release, the reader should refer as well to the factors, uncertainties or risks identified in the company's most recent Form 10-K and all subsequent Form 10-Q reports filed by Microsemi with the SEC. Additional risk factors may be identified from time to time in Microsemi's future filings. The forward-looking statements included in this release speak only as of the date hereof, and Microsemi does not undertake any obligation to update these forward-looking statements to reflect subsequent events or circumstances.

MSCCP 

SOURCE Microsemi Corporation

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