Meeting the "yottabyte era" of data consumption with innovative, scalable wireless backhaul solutions from Texas Instruments

BARCELONA, Feb. 23, 2014 /PRNewswire/ -- MOBILE WORLD CONGRESS -- As the mandate for capacity continues to skyrocket, networks carrying yottabits of traffic will become a reality in the not too distant future. To achieve this kind of capacity operators have begun deploying small cell wireless base stations to offer the best solution for backhaul connectivity. However, the wireless backhaul portion of the solution is well recognized as a challenge due to operators' rigorous demands on efficiency, range and performance.

Today, Texas Instruments (TI) (NASDAQ: TXN) is meeting these requirements with the industry's most flexible backhaul System-on-Chip (SoC), the TCI6631K2L. TI's KeyStone^™-based TCI6631K2L provides developers a common Software Defined Radio (SDR) programmable platform to address the varied configurations of wireless backhaul at a reduced system cost and power consumption. By combining the TCI6631K2L with an analog front end transceiver, the AFE7500, TI has developed a unique two-chip solution designed for scalability and adaptability to cover the Non-Line-of-Sight (NLOS) spectrum from TV white space (TVWS) (UHF/VHF) to 6GHz and Line-of-Sight (LOS) up to 86GHz.

Fully integrated analog + digital solution
As the backhaul market continues to evolve, developers are seeking solutions that offer the highest levels of integration with the flexibility to meet a variety of end product configurations. TI's TCI6631K2L two-chip wireless backhaul solution provides just that; a fully integrated analog and digital solution with a minimal footprint and power profile, enabling a complete design in a small package within a POE+ power footprint. The TCI6631K2L leverages the fastest dual ARM® Cortex® -A15 RISC processors and four of TI's fixed- and floating-point TMS320C66x digital signal processor (DSP) generation cores as part of TI's highly efficient KeyStone SoC architecture supporting L1/L2/L3 and transport processing.

The AFE7500 wireless radio transceiver is a state-of-the-art integrated RF-to-bits SoC. Supporting wideband 2X3 MIMO configuration with integrated data converters and PLLs, the AFE offers best-in-class performance to meet backhaul market needs. AFE7500 interfaces directly to TCI6631K2L via a standard JESD204B connection, allowing the use of digital radio front end (DRFE) features to gain better power amplifier efficiency while reducing board space and system cost. Additional features include auxiliary data converters (ADCs and DACs), temperature sensors and general purpose digital IOs.

In addition to the AFE7500, TI offers a broad portfolio of complementary analog components, including clock and timer solutions and Power over Ethernet PD and PSE solutions. This places TI in a unique position in the industry to meet small cell challenges at a system level. With a longstanding leadership in base station technology, combined with its analog expertise, TI is providing a better wireless experience for all, from consumers to network operators to small cell backhaul manufacturers.

Saving customers time, budget and resources
Leveraging TI's wireless backhaul solution along with the KeyStone-based Multicore Software Development Kit (MCSDK) and RF Software Development Kit (RFSDK), customers can develop a complete SDR platform including features such as WiFar, WiMax and LTE relay for a range of backhaul products. TI's MCSDK is an open source software solution and toolkit, enabling developers to jumpstart use of the TCI6631K2L SoC. The RFSDK facilitates the quick-start capabilities of the AFE7500 and allows simple software configuration change to adapt to nearly any frequency band for NLOS solutions. The MCSDK and RFSDK are shipped together with an Evaluation Module (EVM) for a more robust out-of-the-box experience saving developers man-years of development effort.

Availability
TI's TCI6631K2L will begin sampling in 1Q 2014. Samples of the AFE7500 are available to qualified customers.

Visit TI @ Mobile World Congress
While at MWC, visit TI at 2A4MR and 2B3MR to learn more about the latest communications infrastructure news, and to check out a broad range of TI-based demos. For more information please contact: Ruwanga Dassanayake, WW Business Manager at [email protected].

For more information:

• Read the TCI6631K2L product bulletin and wireless backhaul white paper
• Watch the TCI6631K2L product video  and Ask The Experts video
• Visit TI's new small cell website
• Keep up with the latest happenings  on the Multicore Mix blog
• Engage with engineers and TI experts on the TI E2E™ Community
• Follow TI on Twitter
• Become a fan of TI on Facebook

About TI's KeyStone multicore architecture
Texas Instruments' KeyStone multicore architecture is the platform for true multicore innovation, offering developers a robust portfolio of high performance, low-power multicore devices. Unleashing breakthrough performance, the KeyStone architecture is the foundation upon which TI's new TMS320C66x DSP generation was developed. KeyStone differs from any other multicore architecture as it has the capacity to provide full processing capability to every core in a multicore device. KeyStone-based devices are optimized for high performance markets including wireless base stations, mission critical, test and automation, medical imaging and high performance computing. Learn more at www.ti.com/multicore.

About Texas Instruments
Texas Instruments Incorporated (TI) is a global semiconductor design and manufacturing company that develops analog ICs and embedded processors. By employing the world's brightest minds, TI creates innovations that shape the future of technology. TI is helping more than 100,000 customers transform the future, today. Learn more at www.ti.com.

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SOURCE Texas Instruments

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