CHICAGO, Feb. 1, 2019 /PRNewswire/ -- According to the new market research report on "High Density Interconnect Market by Product (4–6 Layers HDI, 8–10 Layers HDI, and 10+ Layers HDI), End User (Automotive, Consumer Electronics, Telecommunications, Medical), Application, and Geography - Global Forecast to 2023", published by MarketsandMarkets™, the HDI market is expected to grow from USD 9.5 billion in 2018 to USD 16.9 billion by 2023, at a CAGR of 12.3% from 2018 to 2023. A few key factors driving the growth of this market are increasing adoption of advanced electronics and safety measures in the automotive vertical and growing demand for smart consumer electronics and wearable devices.
Ask for PDF Brochure:
https://www.marketsandmarkets.com/pdfdownloadNew.asp?id=179767298
10+ Layers HDI to hold the largest share of the HDI market during the forecast period
10+ layers HDI would likely continue accounting for the largest share of the HDI market during the forecast period. This growth can be attributed to 10+ Layers HDIs being used in a wide range of devices, such as high-reliability automotive products, high-density mobile devices, and IoT modules. 10+ layers HDI offer benefits such as small size, lightweight construction, and enhanced flexibility.
HDI market for the medical end-user segment to grow at the highest CAGR during the forecast period
The HDI market for the medical end-user segment is expected to grow at the highest CAGR during the forecast period. The range of HDI PCB applications in the medical industry is vast and ever-growing. HDI PCBs can be found in pacemakers, defibrillators and heart monitors, medical imaging systems, MRIs, CT scans, and ultrasonic equipment among others. HDI PCBs are also used in medical devices like body temperature monitors, blood glucose monitors, and electrical muscle stimulation equipment.
Browse in-depth TOC on "High Density Interconnect Market"
68 – Tables
39 – Figures
130 – Pages
APAC to hold the largest share of the HDI market during the forecast period
APAC would likely account for the major share of the global HDI market during the forecast period. This growth can be attributed to the increasing application of HDI in consumer electronics, automotive, and healthcare verticals in countries such as China, India, and South Korea. It is also due to the extension of telecommunications networks in China, Thailand, Malaysia, South Korea, India, and other developing countries in APAC.
Get 10% Free Customization on this Report:
https://www.marketsandmarkets.com/requestCustomizationNew.asp?id=179767298
Unimicron (Taiwan), Compeq Co. (Taiwan), TTM Technologies (US), Austria Technologie & Systemtechnik (Austria), Zhen Ding Tech. (Taiwan), IBIDEN (Japan), MEIKO ELECTRONICS Co. (Japan), FUJITSU INTERCONNECT TECHNOLOGIES (Japan), Tripod Technology Corp. (Taiwan), Unitech (Taiwan), SAMSUNG ELECTRO-MECHANICS (South Korea), Daeduck GDS Co (South Korea), DAP Corp. (South Korea), Korea Circuit (South Korea), CMK (Japan), NCAB Group (Sweden), SIERRA CIRCUITS (US), and Multek (Hong Kong) are among the major players in the HDI market.
Please Explore Relevant Reports:
Molded Interconnect Device (MID) Market by Process (LDS, 2-Shot Molding, Film Techniques), Product (Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting), Industry, and Geography - Global Forecast to 2023
Flexible Electronics & Circuit Market by Application (OLED & LCD Display, Printed Sensor, Battery, Thin-Film PV, OLED Lighting), Circuit Structure (Single-Sided, Multilayer, Double-Sided, Rigid), Vertical, and Geography - Global Forecast to 2023
About MarketsandMarkets™
MarketsandMarkets™ provides quantified B2B research on 30,000 high growth niche opportunities/threats which will impact 70% to 80% of worldwide companies' revenues. Currently servicing 7500 customers worldwide including 80% of global Fortune 1000 companies as clients. Almost 75,000 top officers across eight industries worldwide approach MarketsandMarkets™ for their painpoints around revenues decisions.
Our 850 fulltime analyst and SMEs at MarketsandMarkets™ are tracking global high growth markets following the "Growth Engagement Model – GEM". The GEM aims at proactive collaboration with the clients to identify new opportunities, identify most important customers, write "Attack, avoid and defend" strategies, identify sources of incremental revenues for both the company and its competitors. MarketsandMarkets™ now coming up with 1,500 MicroQuadrants (Positioning top players across leaders, emerging companies, innovators, strategic players) annually in high growth emerging segments. MarketsandMarkets™ is determined to benefit more than 10,000 companies this year for their revenue planning and help them take their innovations/disruptions early to the market by providing them research ahead of the curve.
MarketsandMarkets's flagship competitive intelligence and market research platform, "Knowledge Store" connects over 200,000 markets and entire value chains for deeper understanding of the unmet insights along with market sizing and forecasts of niche markets.
Contact:
Mr. Shelly Singh
MarketsandMarkets™ INC.
630 Dundee Road
Suite 430
Northbrook, IL 60062
USA: +1-888-600-641
Email: [email protected]
Research Insight: https://www.marketsandmarkets.com/ResearchInsight/high-density-interconnect-market.asp
Visit Our Web Site: https://www.marketsandmarkets.com
SOURCE MarketsandMarkets
Share this article