Fusion Mixed Signal FPGAs Now Available in Extended Temperature Grade

IRVINE, Calif., Nov. 9, 2010 /PRNewswire-FirstCall/ -- Microsemi Corporation (Nasdaq: MSCC), a leading provider of semiconductor technology aimed at building a secure, smart, connected world, today announced that Fusion mixed signal FPGAs are now available with 100% temperature screening from -55 degrees C to +100 degrees C.  This advancement enables the company to bring the unique mixed signal integration advantages of Fusion to the military, avionics, and defense industries, where highly reliable operation at extreme temperatures is needed. Designers can take advantage of the inherent reprogrammability, high reliability and nonvolatility of the Fusion devices, which offer the additional benefit of firm error immunity. In addition, by offering analog and digital integration in a single chip, Fusion mixed signal FPGAs significantly reduce board space.

Fully tested across the entire temperature range of -55 degrees C to +100 degrees C, extended temperature Fusion FPGAs are offered in two densities of 600K and 1.5M equivalent system gates with up to 223 user I/Os. Functions such as power sequencing and monitoring, as well as supervision and monitoring of voltage, temperature and current can now be performed effortlessly at extreme temperatures. Extended temperature Fusion mixed signal FPGAs are an ideal solution for high reliability applications such as weapons systems and "down wing" aircraft systems that must operate in extreme environments.

"For applications such as industrial and military applications exposed to harsh environments, it is vital that highly reliable components be used," said Ken O'Neill, director, high reliability product marketing at Microsemi's SoC Products Division. "With our history of providing highly reliable devices coupled with testing to these extreme temperatures we continue to offer a significant added value through our unique offering, which is specifically tailored to the military and aerospace market."

Availability

Extended temperature Fusion mixed signal FPGAs are now available for ordering. To order contact Microsemi's worldwide sales team.

About Microsemi

Microsemi Corporation (Nasdaq:MSCC) offers the industry's most comprehensive portfolio of semiconductor technology.  Committed to solving the most critical system challenges, Microsemi's products include high-performance, high-reliability analog and RF devices, mixed signal integrated circuits, FPGAs and customizable SoCs, and complete subsystems.  Microsemi serves leading system manufacturers around the world in the defense, security, aerospace, enterprise, commercial, and industrial markets.  Learn more at www.microsemi.com http://www.microsemi.com ..

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All trademarks are property of Microsemi Corporation. Actel Corporation is a wholly owned subsidiary of Microsemi Corporation.

Actel, Actel Fusion, IGLOO, Libero, Pigeon Point, ProASIC, SmartFusion and the associated logos are trademarks or registered trademarks of Microsemi Corporation. All other trademarks and service marks are the property of their respective owners.

"Safe Harbor" Statement under the Private Securities Litigation Reform Act of 1995: Any statements set forth in this news release that are not entirely historical and factual in nature, including without limitation statements related to Fusion mixed signal FPGAs that are now available with 100% temperature screening from -55 degrees C to +100 degrees C, and its potential effects on future business, are forward-looking statements. These forward-looking statements are based on our current expectations and are inherently subject to risks and uncertainties that could cause actual results to differ materially from those expressed in the forward-looking statements. The potential risks and uncertainties include, but are not limited to, such factors as rapidly changing technology and product obsolescence, potential cost increases, variations in customer order preferences, weakness or competitive pricing environment of the marketplace, uncertain demand for and acceptance of the company's products, adverse circumstances in any of our end markets, results of in-process or planned development or marketing and promotional campaigns, difficulties foreseeing future demand, potential non-realization of expected orders or non-realization of backlog, product  returns, product  liability, and other potential unexpected business and economic conditions or adverse changes in current or expected industry conditions, difficulties and costs of protecting patents and other proprietary rights, inventory obsolescence and difficulties regarding customer qualification of products. In addition to these factors and any other factors mentioned elsewhere in this news release, the reader should refer as well to the factors, uncertainties or risks identified in the company's most recent Form 10-K and all subsequent Form 10-Q reports filed by Microsemi with the SEC. Additional risk factors may be identified from time to time in Microsemi's future filings.  The forward-looking statements included in this release speak only as of the date hereof, and Microsemi does not undertake any obligation to update these forward-looking statements to reflect subsequent events or circumstances.

SOURCE Microsemi Corporation

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