Fibocom Showcases SC153 5G Smart Module at NetworkX, Leveraging a Qualcomm Platform to Accelerate 5G Smart Device Development

VIENNA, Oct. 13, 2026 /PRNewswire/ -- As AI applications increasingly extend to end devices, smart devices are evolving from basic data connectivity toward real-time interaction and intelligent experiences, creating greater demand for high-speed, stable, low-latency wireless connectivity.

At NetworkX 2026, Fibocom is showcasing its SC153 5G smart module for the first time. Built on the Qualcomm Dragonwing™ Q-4390 processor, SC153 addresses next-generation smart devices' requirements for high-speed connectivity and complex applications, providing customers worldwide with a high-performance 5G connectivity solution that offers development flexibility.

The product is currently undergoing debugging, with mass production planned for the fourth quarter of 2026.

High-Speed 5G Connectivity Unlocks Device Potential

As applications such as high-definition video transmission, industrial data acquisition and smart device connectivity continue to develop, devices face increasing requirements for high-speed data transmission and stable network connectivity.

Designed with advanced 5G communications capabilities, SC153 supports 3GPP Release 16 and provides multimode connectivity across 5G NR sub-6 GHz and LTE, meeting the network performance and deployment flexibility requirements of different applications.

For connectivity performance, SC153 supports both 5G standalone (SA) and non-standalone (NSA) network architectures, delivering maximum downlink speeds of 2.3 Gbps in SA mode and 2.5 Gbps in EN-DC mode. These capabilities enable stable, efficient data transmission for applications including high-definition video, industrial equipment and smart devices.

Flexible Design Meets Diverse Device Requirements

To support the rapid evolution of smart devices, customers need not only communications performance but also greater flexibility in hardware design and software development.

SC153 uses an LGA package and provides a wide range of interfaces, including MIPI display, MIPI camera, USB 3.1, UART, I²C and SD, while flexibly supporting Wi-Fi 5, Wi-Fi 6E and Wi-Fi 7 configurations to meet the design requirements of different device form factors.

SC153 also supports the Android operating system, providing a more flexible platform for software development, application expansion and device customization.

With its high-speed connectivity and development flexibility, SC153 can help customers develop a new generation of wireless products for smart devices, industrial equipment and high-speed data applications.

Working with Ecosystem Partners to Advance Device Innovation

Edward Ai, Senior Director of Product Marketing at Qualcomm Technologies, said:.

"5G and application processing capabilities are converging at an accelerating pace, creating more opportunities for product innovation in next-generation smart devices. Qualcomm Dragonwing platforms are designed to provide device manufacturers with platform capabilities for intelligent edge devices. We look forward to further strengthening our collaboration with Fibocom and extending advanced platform capabilities to more smart device applications."

Thales Zhang, Vice President and Head of the Global Marketing and Computing Business Group at Fibocom, said:

"As smart device form factors become increasingly diverse, customers are placing greater demands on 5G connectivity and device development efficiency. SC153 is an important addition to Fibocom's portfolio for next-generation 5G smart devices. We aim to leverage Qualcomm's advanced platform to translate new connectivity capabilities more quickly into devices that customers can deploy."

Looking ahead, Fibocom will continue working with industry ecosystem partners to accelerate the deployment of 5G connectivity across a broader range of smart devices.

About Fibocom

Fibocom, founded in 1999, is China's first wireless communication module company listed on both the A-share and H-share markets. Fibocom leverages wireless communication and artificial intelligence as its core technologies to provide integrated hardware and software solutions that empower industry applications. These solutions accelerate the transformation from "Connect Everything" to "Intelligent Connectivity" across diverse industries.

Fibocom's one-stop solutions encompass cellular communication, AI, automotive, and GNSS modules, as well as AI toolchains, supporting industry-side and mainstream large model integration, and providing AI Agent, global connectivity, and cloud services, driving the digital intelligence upgrades in industries such as robotics, consumer electronics, low-altitude economy, intelligent transportation, smart retail, and smart energy.

SOURCE Fibocom