Expanded Collaboration, Quarterly Results, Deployments, and New Releases - Analyst Notes on Micron, TSMC, Broadcom, ASML and Xilinx

NEW YORK, April 23, 2014 /PRNewswire/ --

Today, Analysts Review released its analysts' notes regarding Micron Technology, Inc. (NASDAQ: MU), Taiwan Semiconductor Manufacturing Co., Ltd. (NYSE: TSM), Broadcom Corporation (NASDAQ: BRCM), ASML Holding NV (NASDAQ: ASML) and Xilinx, Inc. (NASDAQ: XLNX). Private wealth members receive these notes ahead of publication. To reserve complementary membership, limited openings are available at: http://www.analystsreview.com/1450-100free.

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Micron Technology, Inc. Analyst Notes
On April 15, 2014, Micron Technology, Inc. (Micron) announced that it is expanding its relationship with Wave Systems Corp. (Wave Systems) to develop solutions that strengthen user protection against current and emerging threats to compute and embedded platforms. Micron stated that the collaboration focuses on the detection and remediation of advanced persistent threats (APTs). "We're pleased to be working with Micron in developing advanced solutions that combine hardware and software security protection," said Bill Solms, CEO of Wave Systems. "Our expanded agreement will allow us to build on our existing software solutions and take security of client applications to the next level." The collaboration between Micron and Wave Systems expand on their ongoing activities around management for Micron's self-encrypting SSD drives. The Companies expect future announcements on the products in development in H2 2014. The full analyst notes on Micron are available to download free of charge at:

http://www.analystsreview.com/1450-MU-23Apr2014.pdf

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Taiwan Semiconductor Manufacturing Co., Ltd. Analyst Notes
On April 17, 2014, Taiwan Semiconductor Manufacturing Co., Ltd. (TSMC) reported its Q1 2014 results. In Q1 2014, the Company's net sales amounted to NT$148.2 billion, up 11.6% YoY. Q1 2014 net income was NT$47.9 billion, or NT$1.85 per share, compared to NT$39.6 billion, or NT$1.53 per share, in Q1 2013. "In the first quarter, we saw much stronger demand for our wafers across all segments but more pronounced in mobile related applications, than we had initially predicted in January," said Lora Ho, Senior Vice President and CFO of TSMC. "Thanks to the better performance and higher yield and reliability of our advanced technologies, we saw a strong rebound of demand for our leading nodes extending beyond the first quarter." The full analyst notes on TSMC are available to download free of charge at:

http://www.analystsreview.com/1450-TSM-23Apr2014.pdf

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Broadcom Corporation Analyst Notes
On April 16, 2014, Broadcom Corporation (Broadcom) announced that Lava International Limited (Lava) has selected Broadcom's quad-core HSPA+ turnkey platform for Lava's newly released QPAD e704 tablet, enabling lava to produce an affordable feature-rich tablet with the advanced connectivity and entertainment capabilities. Broadcom stated that its turnkey connectivity platform optimizes power consumption in the QPAD tablet, allowing for longer battery life and an increase in standby and run times. The full analyst notes on Broadcom are available to download free of charge at:

http://www.analystsreview.com/1450-BRCM-23Apr2014.pdf

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ASML Holding NV Analyst Notes  
On April 16, 2014, ASML Holding NV (ASML) reported its Q1 2014 results with net sales of €1.4 billion, down 2.2% QoQ. Q1 2014 net income was €249.0 million or €0.57 per basic share, compared to €481.0 million or €1.09 per basic share in Q4 2013. "We are pleased to report that our first-quarter sales came in as expected, largely driven by memory customers. Our gross margin was better than expected because of a favorable product mix compared with what we had forecasted and the contribution of our Holistic Lithography products. Sales in the second quarter are however expected to be affected by adjustments of system demand from some logic customers. This means first-half 2014 sales will be around €3 billion including sales from Extreme Ultraviolet (EUV) systems, versus earlier guidance of around €3 billion which excluded EUV," said Peter Wennink, President and CEO of ASML. The full analyst notes on ASML are available to download free of charge at:  

http://www.analystsreview.com/1450-ASML-23Apr2014.pdf

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Xilinx, Inc. Analyst Notes
On April 16, 2014, Xilinx, Inc. (Xilinx) announced that it has released the Vivado Design Suite 2014.1, the industry's only SoC-strength development environment. The Company stated that the release extends the automation of the UltraFast design methodology, delivering an average of 25% faster runtimes and 5% improvement in performance across all devices. In addition, Xilinx has also introduced the new Xilinx Tcl Store where the design community can freely publish and share qualified scripts that perform useful functions and improve productivity. The full analyst notes on Xilinx are available to download free of charge at:

http://www.analystsreview.com/1450-XLNX-23Apr2014.pdf

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