Ekahau and WLAN Vendors to Speak on Wi-Fi Design Best Practices Panel at BICSI 2013

RESTON, Va., Oct. 1, 2013 /PRNewswire/ -- Ekahau Inc., the Wi-Fi tools innovator behind Ekahau Site Survey (ESS™), will participate in the Building Industry Consulting Service International (BICSI) North-Central Region meeting in Columbus, Ohio on October 1^st, 2013. BICSI is a professional association supporting information technology system (ITS) decision-makers. Ekahau's Vice President of Wi-Fi Tools, Jussi Kiviniemi, and WLAN experts from Hewlett-Packard, Ruckus Wireless, Aruba Networks and Xirrus, will participate in a panel discussion entitled "The Good, The Bad and The Ugly: Overcoming the Real World Challenges of Designing Wireless Networks".

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Ekahau will also showcase its Wi-Fi Design tools, including Ekahau Site Survey™, in a series of "What's New, What's It Do?" demonstrations, which take place at the Boat House Restaurant at Confluence Park.  The demonstrations will address networking hot topics surrounding the design of 802.11ac, 802.11n, high capacity Wi-Fi and BYOD. Ekahau will also hold live product demonstrations using its Android-based Wi-Fi survey tool, spectrum analyzer and its Ekahau Site Survey 6.0 Wi-Fi planning and deployment tool.

About Ekahau Wi-Fi Tools

Ekahau Inc. is the performance leader in providing cutting-edge Wi-Fi site survey, planning, design and optimization tools as well as Wi-Fi-based Real-Time Location Systems (RTLS). Ekahau Wi-Fi Design tools, including Ekahau Site Survey™, Ekahau Mobile Survey™, Ekahau HeatMapper™ and Ekahau Spectrum Analyzer™ are used by hundreds of thousands of network engineers, IT administrators and wireless consultants to deploy the world's best performing Wi-Fi networks. Ekahau partners include Aruba, Ascom, Cisco, HP, IBM, Schneider Electric along with major Wi-Fi infrastructure providers, and customers include hundreds of schools, hospitals, hotels, and nearly all of the world's largest telecom operators. Learn more about Ekahau Wi-Fi Tools at: www.ekahau.com/wifidesign, on the Ekahau Blog, Facebook, Twitter and LinkedIn or email [email protected].

Contact: Paul C. DiPerna
Ph: +1 781 684 0770
[email protected]

SOURCE Ekahau Inc.