SAN FRANCISCO, Feb. 20, 2014 /PRNewswire/-- UBM Tech's EE Live! 2014, the industry's largest and most comprehensive electronics technology conference and expo in the United States, today announced it will offer a two-day Black Hat Embedded Security Summit on Wednesday, April 2 and Thursday, April 3. The Summit will provide essential information and tools as well as a forum for the discussion and evaluation of the latest solutions for securing embedded systems from threats in today's global environment.
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Key sessions from industry thought leaders include:
- Joe Grand, Electrical Engineer, Inventor and Hardware Hacker, Grand Idea Studio. Grand will present "Using Superpowers for PCB Reverse Engineering"
- Craig Heffner, Vulnerability Researcher, Tactical Network Solutions. Heffner will present "Finding and Reversing Engineering Backdoors in Consumer Firmware"
- Mike Ryan, Security Engineer, iSEC Partners. Ryan will present "Bluetooth Smart: Not Actually That Smart"
- Chris Tarnovsky, Vice President of Semiconductor Security Services, IOActive. Tarnovsky will present "Analyzing a Secure Smart Card Grade Device: Physical Teardown"
"We constantly hear about hackers breaching computer networks as well as the threats they pose to disrupting vital services. Engineers that attend this Summit will gain a greater understanding of security risks to information infrastructures and computer systems as well as the latest solutions for safeguarding these systems," said Karen Field, SVP Editorial Director, EE Times and GM, EE Live!.
EE Live! sponsors include Diamond Sponsor, Microchip Technology and Silver Sponsors, Texas Instruments, Rohde & Schwartz and STMicroelectronics. View exhibitor list.
For additional information on EE Live!, visit eeliveshow.com
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Interested in Attending?
Registration is now open for EE Live! Please register online here or contact EE Live! registration customer service at (415) 947-6918 or (866) 535-8993.
About EE Live!
UBM Tech's EE Live! is the largest and most comprehensive electronics technology conference and expo in the United States. Created by engineers, for engineers, EE Live! brings the global engineering community together to learn, gain inspiration and celebrate engineering. The conference program at EE Live! includes The IEC MGMT Summit, ESC (The Embedded Systems Conference), Engineering Summits, Boot Camps, and Tutorials. EE Live! offers an unprecedented forum of industry intelligence, hands-on learning and education and the latest products and innovations from 200+ vendors. EE Live! is tightly integrated with EE Times, Embedded.com and EDN, which creates the opportunity for the live event community to continue the conversation online, 365 days a year.
About UBM Tech
UBM Tech is a global media business that brings together the world's technology communities through live events, online properties and custom services. UBM Tech's community-focused approach provides its users and clients with expertly curated research, education, training, community advocacy, user-generated content and peer-to-peer engagement opportunities that serve the Electronics, Security, Enterprise IT and Communications, Network Infrastructure and Applications, Game and App Developers, and Tech Marketing communities. UBM Tech's brands include Black Hat, DesignCon, EE Times, Enterprise Connect, Game Developers Conference (GDC), HDI, InformationWeek, and Interop. Create, a UBM Tech full range marketing services division, includes custom events, content marketing solutions, community development and demand generation programs based on its content and technology market expertise. UBM Tech is a part of UBM (UBM.L), a global provider of media and information services with a market capitalization of more than $2.5 billion. For more information, go to http://tech.ubm.com.
For more information on UBM Tech please contact:
Linda Uslaner
UBM Tech
Phone: +1-516-562-5843
[email protected]
Available Topic Expert(s): For information on the listed expert(s), click appropriate link.
Karen Field
http://www.profnetconnect.com/karenfield
SOURCE UBM Tech
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