ChipMOS REPORTS 22.2% YoY INCREASE IN 4Q23 REVENUE AND 21.1% YoY INCREASE IN DECEMBER 2023 REVENUE

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Jan 10, 2024, 06:00 ET

HSINCHU, Jan. 10, 2024 /PRNewswire-FirstCall/ -- ChipMOS TECHNOLOGIES INC. ("ChipMOS" or the "Company") (Taiwan Stock Exchange: 8150 andNASDAQ: IMOS), an industry leading provider of outsourced semiconductor assembly and test services ("OSAT"), today reported its unaudited consolidated revenue for the month of December 2023 and for the fourth quarter ended December 31, 2023. All U.S. dollar figures cited in this press release are based on the exchange rate of NT$30.62 to US$1.00 as of December 29, 2023.

Revenue for the fourth quarter of 2023 increased 22.2% from the fourth quarter of 2022 to NT$5,725.4 million or US$187.0 million, representing an increase of 2.6% from the third quarter of 2023. The Company noted revenue growth in the fourth quarter of 2023, both year over year and quarter over quarter, was led by improvements across the broader memory industry.

Revenue for the month of December 2023 was NT$1,881.5 million or US$61.4 million, representing an increase of 0.4% from November 2023, and an increase of 21.1% from December 2022.

Consolidated Monthly Revenues (Unaudited)
	December 2023	November 2023	December 2022	MoM Change	YoY Change
Revenues (NT$ million)	1,881.5	1,873.9	1,553.8	0.4 %	21.1 %
Revenues (US$ million)	61.4	61.2	50.7	0.4 %	21.1 %

Consolidated Quarterly Revenues (Unaudited)
	Fourth Quarter 2023	Third Quarter 2023	Fourth Quarter 2022	QoQ Change	YoY Change
Revenues (NT$ million)	5,725.4	5,581.5	4,686.2	2.6 %	22.2 %
Revenues (US$ million)	187.0	182.3	153.0	2.6 %	22.2 %

About ChipMOS TECHNOLOGIES INC.:
ChipMOS TECHNOLOGIES INC. ("ChipMOS" or the "Company") (Taiwan Stock Exchange: 8150 andNASDAQ: IMOS) (www.chipmos.com) is an industry leading provider of outsourced semiconductor assembly and test services. With advanced facilities in Hsinchu Science Park, Hsinchu Industrial Park and Southern Taiwan Science Park in Taiwan, ChipMOS is known for its track record of excellence and history of innovation. The Company provides end-to-end assembly and test services to leading fabless semiconductor companies, integrated device manufacturers and independent semiconductor foundries serving virtually all end markets worldwide.

Forward-Looking Statements:
This press release may contain certain forward-looking statements. These forward-looking statements may be identified by words such as 'believes,' 'expects,' 'anticipates,' 'projects,' 'intends,' 'should,' 'seeks,' 'estimates,' 'future' or similar expressions or by discussion of, among other things, strategies, goals, plans or intentions. These statements may include financial projections and estimates and their underlying assumptions, statements regarding plans, objectives and expectations with respect to future operations, products and services, and statements regarding future performance. Actual results may differ materially in the future from those reflected in forward-looking statements contained in this document, due to various factors. Further information regarding these risks, uncertainties and other factors are included in the Company's most recent Annual Report on Form 20-F filed with the U.S. Securities and Exchange Commission (the "SEC") and in the Company's other filings with the SEC.

Contacts:

In Taiwan

Jesse Huang

ChipMOS TECHNOLOGIES INC.

+886-6-5052388 ext. 7715

[email protected]

In the U.S.

David Pasquale

Global IR Partners

+1-914-337-8801

[email protected]

SOURCE ChipMOS TECHNOLOGIES INC.