Broadcom Boosts 4G LTE Mobile Backhaul Capacity with New Microwave SoC Series

BARCELONA, Spain, Feb. 25, 2013 /PRNewswire/ -- Mobile World Congress 2013

News Highlights:

• Complete baseband and RF chipset optimized for high-bandwidth data requirements
• Series includes a powerful multi-core SoC to maximize throughput capacity
• Industry's highest level of integration lowers power consumption and system cost

Broadcom Corporation (NASDAQ: BRCM), a global innovation leader in semiconductor solutions for wired and wireless communications, today announced a new high modulation microwave system-on-a-chip (SoC) series optimized for high-speed wireless connectivity in 4G LTE networks. With the industry's highest modulation of 4K-QAM, the BCM85625 Series enables 50 percent higher capacity, allowing telecom operators to more efficiently deliver broadband services. Visit Broadcom @ Mobile World Congress for more news.

With wireless traffic on a constant growth trajectory, carriers are challenged to backhaul high-bandwidth data services from cell sites to the core network. To maximize throughput capacity and spectrum efficiency, Broadcom's BCM85625 SoC series features a powerful multi-core SoC that integrates full cross-polarization interference cancellation (XPIC) and multi-channel functionality.

"Broadcom is recognized across the industry as the leader of merchant silicon used in microwave backhaul equipment. In order to meet the demand for higher performance microwave for backhaul traffic from growing numbers of small cells, we expect that Broadcom will help drive innovation with carrier-grade SoCs like the BCM85625," said Michael Howard, Principal Analyst and Co-founder of Infonetics Research. "As a result of accelerating data requirements, we expect the macrocell backhaul equipment market to grow steadily over the next several years with cumulative spending to reach $44 billion by 2016 with another $5 billion for outdoor small cell backhaul equipment."

"With dramatic improvements in modulation and the industry's highest level of integration, the BCM85625 SoC series delivers 50 percent more capacity, allowing carriers to more efficiently manage high-bandwidth broadband services," said Dan Charash, Broadcom Senior Director and General Manager, Microwave. "When combined with our BCM85810, Broadcom is the first to deliver a complete baseband and radio frequency solution to satisfy current and future data requirements and increase capacity in the mobile backhaul."

Availability
The BCM85625 series is now sampling with volume production slated for Q2 2013.

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About Broadcom

Broadcom Corporation (NASDAQ: BRCM), a FORTUNE 500® company, is a global leader and innovator in semiconductor solutions for wired and wireless communications. Broadcom® products seamlessly deliver voice, video, data and multimedia connectivity in the home, office and mobile environments. With the industry's broadest portfolio of state-of-the-art system-on-a-chip and embedded software solutions, Broadcom is changing the world by Connecting everything®. For more information, go to www.broadcom.com.

Broadcom®, the pulse logo, Connecting everything® and the Connecting everything logo are among the trademarks of Broadcom Corporation and/or its affiliates in the United States, certain other countries and/or the EU.  Any other trademarks or trade names mentioned are the property of their respective owners.

Contacts

SOURCE Broadcom Corporation; BRCM Infrastructure & Networking

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