Apple iPhone X - MEMS Microphones Complete Teardown Report 2018 Featuring Goertek, AAC Technologies, Knowles & Infineon

DUBLIN, July 25, 2018 /PRNewswire/ --

The "Apple iPhone X - MEMS Microphones Complete Teardown Report" report has been added to ResearchAndMarkets.com's offering.

For microphone integration in the iPhone X, Apple has chosen the market's top three microphone suppliers: Goertek, Knowles, and AAC Technologies.

The Apple iPhone X has four MEMS microphones: a front-facing top microphone, two front-facing bottom microphones, and a rear-facing top microphone. This layout is similar to previous iPhones, but the front-facing bottom-right microphone is now integrated in the speaker module. All four microphones share the same Apple-specific package dimensions, but with a different internal structure (number of substrate metal layers, embedded capacitance, ASIC, etc.).

In the iPhone X, we've observed changes to the microphones provided by Apple's three suppliers:

Goertek, which still relies on Infineon for die manufacturing, integrates Infineon's technology with a double backplate, delivering a differential MEMS microphone. For the ASIC, Goertek has considerably reduced the die area by around 40% compared to the previous die.

Knowles uses the same technologies as before, but one part has a new MEMS design and another part has an existing MEMS design.

AAC uses the same MEMS microphone die as Goertek, but with a different ASIC.

Infineon is a big winner. By providing ASIC and MEMS dies to all of Goertek's and AAC Technologies' products, it now possesses a large share of the MEMS microphone market.

Key Topics Covered:

Overview/Introduction

Company Profile and Supply Chain

iPhone X - Teardown

Goertek/Knowles/AAC Technologies

Physical Analysis

• Package
• Package view and dimensions
• Package opening
• Package cross-section
• ASIC Die
• View, dimensions and marking
• Dicing
• Delayering and process
• Cross-section
• MEMS Die
• View, dimensions and marking
• Dicing
• Membrane and backplate
• Anti-stiction bumps
• Cavity
• Cross-section

Manufacturing Process Flow

• ASIC Front-end Process
• ASIC Wafer Fabrication Unit
• MEMS Process Flow
• MEMS Wafer Fabrication Unit
• Packaging Process Flow
• Package Assembly Unit

Physical Analysis Comparison

Goertek/Knowles/AAC Technologies - Cost Analysis

• Cost Analysis Overview
• Yield Hypotheses
• ASIC Front-end Cost
• ASIC Wafer and Die Cost
• MEMS Front-end Cost
• MEMS Wafer and Die Cost
• Back-end: Packaging Cost
• Microphone Component Cost

Goertek/Knowles/AAC Technologies - Estimated Sales Price

Manufacturing Cost Comparison

For more information about this report visit https://www.researchandmarkets.com/research/36t949/apple_iphone_x?w=5

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