3D Electronics Printing Market Set to Achieve a Remarkable 10-Year CAGR of 37%, Reaching $7.9 Billion by 2033

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Nov 08, 2023, 14:15 ET

DUBLIN, Nov. 8, 2023 /PRNewswire/ -- The "3D Printed Electronics 2023: Market Study & Forecast" report has been added to ResearchAndMarkets.com's offering.

The 3D electronics printing (3DEP) market is expected to experience significant growth in the coming years. This is due to the advancements in printing technology and platform capability, alongside the ongoing development and demonstration of the applications of 3D electronics printing.

The market is projected to achieve a 10-year CAGR of 37%. The market size for 3D electronics printing is also expanding, with an estimated total market value of $0.3 billion in 2023, which is expected to increase to $7.9 billion by 2033.

This report describes the value propositions of 3DEP, the challenges to market growth, key players in the 3DEP space, and detailed market data and forecasting.

Companies or organizations covered in this report include, but are not limited to: Ceradrop, Nano Dimension, NeoTech, Optomec, FujiFilm, Voltera, BotFactory, nScrypt, J.A.M.E.S., NextFlex, ChemCubed, PV Nanocell, Panasonic, Additive Electronics, Nano3DPrint, and Notion Systems.

Key Topics Covered:

Chapter One: Trends, opportunities and challenges

Background and context to this report
Reading this report
Trends, Opportunities, and challenges in the 3D printing electronics space
The current and future potential for 3D printing electronics technologies and applications
Mapping the current competitive landscape
Building a future view of the industry and forecasting its opportunity for growth
The current 3D printing electronics space
3D Electronics Printing prepares to move from the lab to the factory
Electronics prototyping remains the go-to application
Moving PCB prototyping in-house
Standing at the precipice of commercial 3D printed electronics
Notable trends driving the direction of the industry
Sustainability
Reducing material consumption in prototyping
Recyclability through design
Miniaturisation of devices reducing life cycle impact
Supply Chain security and compression
Supporting Semiconductor production using conventional 3D printing
Creating helpful incentives to produce semiconductors (CHIPs) act
Opportunities
Internet of things
Conformal printing of antenna within IoT devices
Volumetric IoT
Flexible IoT
Low volume, high mix electronics become increasingly viable
Miniaturisation of electronics
Off-setting the limitations of physics through compact circuit design
Interconnects
Passives
Embedded and stacked components and vertically integrated ICs
Protecting Intellectual Property via moving to in-house prototyping
Freedom of Design
Top, bottom and side-mounted components, adding another angle to circuit boards
Higher density routing with multi-directional vias
Challenges
Volume production
Overcoming production volume with SMT integration in the print process
Continuing materials development
Building a seamless digital thread for 3D printed electronics
Delineation of electronic computer-aided design and mechanical computer-aided design begin to blur
Emerging software solutions to bridge the gap

Chapter Two: Technology, Applications and Markets

Technologies
Technologies capable of printing conductive materials
Polymer Powder Bed Fusion
Vat Photopolymerization
Technologies capable of printing static-dissipative materials
Polymer Powder Bed Fusion
Vat Photopolymerisation
Material Extrusion
3D Electronic Printing Technologies
Inkjet Printing
Aerosol Jet Printing
Extrusion-Based Printing
Materials
Conductive Inks
Silver Nanoparticle Inks
Extrusion materials and limitations
Dielectric inks and resins
Applications
PCBs
3D printed multi-layer PCBs
Future of printed PCBs
Connectors and Interconnects
Antennas, Amplifiers and Transceiver
3DEP supporting advanced antenna production
Multi-material printing of next-generation antenna
Rise of 6G
Capacitors
Sensors
Quantum sensors
Beyond the PCB: 3DEP innovations in next-generation components and applications
Optoelectronics
Batteries
Lab-on-chips

Chapter Three: Market players

Nano Dimension, Israel, 2012
Nano Dimensions attempts to acquire Stratasys
Financial performance
Technology - Dragonfly IV
Materials
Partnerships
Optomec, United States, 1997
Technology
Aerosol Jet Printer Portfolio
Aerosol jet HD2
Aerosol Jet AJ Flex
Aerosol Jet Print Engine
Bot Factory, United States, 2013
Ceradrop, France, 2006
Ceradrop Technology
F-serie
X-Serie
Industrial platform
Chemcubed, United States, 2014
NeoTech, Germany, 2006
Technology
15X BT
45XG4
PV Nanocell, Israel, 2010
Voltera, Canada, 2013
Fujifilm Corporation, Japan, 1934
Technology
Panasonic, Japan, 1918
Additive Electronics, Germany, 2022
Notion Systems, Germany, 2012
nScrypt, United States, 2002
Nano3DPrint, United States, 2013
Entry into the professional space with the D4200S

Chapter Four: Ten year forecasts

For more information about this report visit https://www.researchandmarkets.com/r/30fa9s

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