DUBLIN, March 9, 2021 /PRNewswire/ -- The "E-Beam Wafer Inspection Systems - Global Market Trajectory & Analytics" report has been added to ResearchAndMarkets.com's offering.
The global market for E-Beam Wafer Inspection System is projected to reach US$1.2 billion by 2025, driven by the growing demands placed on semiconductor companies to optimize yield management.
The focus on metrology and high performance quality control is therefore increasing. Rapid digitalization and evolution of Internet of Things (IoT), Artificial Intelligence (AI), and machine learning technologies are driving the need for faster, smaller, low power devices, bringing in new challenges for semiconductor manufacturers.
While wafer size is increasing from 200 mm to 300nm, critical dimensions of semiconductor circuits (patterns) is rapidly shrinking to 0.13 um and 0.10 um. As critical dimensions shrink, identifying defects becomes more difficult and time-consuming. However, in order to ensure profitability and production efficiency, yield limiting defects need to be identified early on in the manufacturing flow.
Wafer defect inspection is therefore emerging into an important step in the semiconductor manufacturing process. Intrinsic defects on bare wafers if left undetected can lead to killer defects on final processed wafer/chips. Early detection of physical defects and pattern defects on wafers can help save companies millions of dollars in production losses.
E-Beam Wafer Inspection System, in this regard, is witnessing strong growth and adoption supported by benefits such as minimized total time for detecting and fixing defects on processed wafers; higher return-on-investment for semiconductor fabricators; high resolution; effective for inspecting nodes at 10 nm and below; ability to identify defects residing deep within the wafer structures; and effectively identifies electrical defects that impact yield. Technology developments aimed at enhancing throughput speeds are of vital importance, given that slow throughput is the Achilles Heel of the technology.
Other major noteworthy trends in the market include innovations in multi-beam e-beam inspection brings the promise of reduced cost of inspection for each node; growing replacement of optical inspection with e-beam inspection as new architectures like finFETs & 3D NAND emerge. Asia-Pacific excluding China represents the largest market worldwide with a 30.3% share. U.S., Japan and China represent the other major markets with a combined share of 43.6%.
China ranks as the fastest growing market with a 22.3% CAGR over the analysis period supported by the Chinese governments efforts to build a self-sufficient, homegrown semiconductor industry against the backdrop of intensifying U.S.-China trade war. Funding support, favorable policies and R&D push have already resulted in the establishment of several start-ups focusing on AI and machine learning hardware.
As the country initiates its long-term plan of reducing dependence on US chip technology, semiconductor infrastructure in the country will receive a boost spurring opportunities for production technologies like e-beam inspection.
Asia-Pacific excluding China follows next with a 21.4% CAGR led by established semiconductor manufacturing giants such as Taiwan and South Korea.
Key Topics Covered:
I. INTRODUCTION, METHODOLOGY & REPORT SCOPE
II. EXECUTIVE SUMMARY
1. MARKET OVERVIEW
- Semiconductor Industry: An Overview
- Global Semiconductor Industry CAPEX (in US$ Billion) for Years 2016, 2018 & 2022F
- Global Personal Electronics Market by Product Category in Million Units for the Years 2016, 2018 and 2020
- Dynamics of E-Beam Wafer Inspection Systems Tied to Semiconductor Manufacturing
- Growing Sophistication of Semiconductor Wafer Designs Stimulates Demand
- Wafer Defect Inspection System: An Introduction
- Types of Wafer Defect Inspection Systems
- E-Beam Wafer Inspection System: A Prelude
- Resolving Power Less Than 1 nm
- Resolving Power 1 to 10 nm
- Resolving Power More Than 10 nm
- E-Beam Wafer Inspection System: Industry Overview
- More Than 10 nm Inspection Resolution Dominates the Product Category
- Defect Imaging: The Largest End-Use Application Market
- Asia Maintains Large Lead in the E-Beam Wafer Inspection System Market
- Global Competitor Analysis
- Focus Shifts to R&D
- Global Competitor Market Shares
- E-Beam Wafer Inspection System Competitor Market Share Scenario Worldwide (in %): 2019
- Global Semiconductor Metrology/Inspection Competitor Market Share (in %): 2019
- Impact of Covid-19 and a Looming Global Recession
2. FOCUS ON SELECT PLAYERS
- Applied Materials, Inc. (USA)
- ASML Holding NV (The Netherlands)
- Hitachi High-Technologies Corporation (Japan)
- KLA Corporation (USA)
- Lam Research Corporation (USA)
- Photo electron Soul Inc. (Japan)
3. MARKET TRENDS & DRIVERS
- Analysis of the E-Beam Wafer Inspection System Market
- Key Growth Drivers in the E-beam Wafer Inspection System Market
- Multi-Beam Technology Holds Immense Potential
- Enhanced Defect Detection
- E-Beam Inspection Systems Find Use for R&D Purposes
- Robust Demand for Semiconductor Wafers Key to Growth of E-Beam Inspection System
- Global Integrated Circuits Semiconductor Market in US$ Billion for the Years 2014, 2016, 2018 and 2020
- Global Semiconductor Integrated Circuit (IC) Wafer Capacity in Millions of 200mm-Equivalent Wafers for the Years 2014, 2016, 2018 and 2020
- R&D Spending in Semiconductor Industry Continues to Rise: An Opportunity for E-Beam Wafer Inspection Market
- Global Semiconductor R&D Spending: Compounded Annual Growth Rate (%) of R&D Expenditure for the Periods 2003-2008, 2008-2013, 2013-2018 and 2018-2023F
- US Semiconductor Industry: Capital and R&D Investment in US$ Billion for the Years 2010, 2012, 2014, 2016 and 2018
- Increasing Demand for Semiconductor Wafers and Growing Complexity of Wafer Design and Manufacturing Process Augurs Well for E-Beam Wafer Inspection Systems Market
- Global Semiconductor Silicon Wafer Market: Revenues in US$ Billion for the Years 2019E, 2021F, 2023F and 2025F
- Global New Semiconductor Manufacturing Equipment Sales in US$ Billion by Geographic Region for the Years 2016, 2018 and 2020F
- Optical Vs E-Beam Wafer Inspection System
- Select Innovative Technologies Impacting Growth and Future Prospects
- Technical Perspective of Smart E-Beam for Defect Identification & Analysis in the Nanoscale Technology Nodes
- SiC Wafer Defect Inspection: An Innovative Technology
- E-beam Inspection Technology Identifies Hard-to Find Defects, but Speed Remains an Issue
- Use of E-beam Inspection in Yield Learning Process and for Conventional Voltage Contrast Mode
- Challenges Lead to Development of Multi-Beam Inspection Technology
- High Implementation Cost and Slow Throughput: Major Restraints
4. GLOBAL MARKET PERSPECTIVE
III. MARKET ANALYSIS
IV. COMPETITION
Total Companies Profiled: 9
For more information about this report visit https://www.researchandmarkets.com/r/hczceb
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