Silex Microsystems Joins ENIAC Joint Undertaking Project EPAMO To Develop Advanced RF Solutions for 4G Mobile Systems
Silex Will Develop Innovative Through-Silicon Via, PZT Piezoelectric, and Integrated Passive Device Technologies as Part of this Multi-Company Effort
JARFALLA, Sweden, Jan. 23, 2012 /PRNewswire/ -- Silex Microsystems, the world's largest pure-play MEMS foundry, today announced that it has joined an international European Union-funded program aimed at developing a new technology platform with the goal of developing advanced RF solutions for 4G base stations and mobile handsets. The program, "Energy-efficient Piezo-MEMS Tunable RF Front-End Antenna Systems for Mobile Devices," or EPAMO, is developing new technologies to realize future high performance RF-systems, energy efficient mobile communication systems, highly miniaturized and integrated RF components, and cost efficient solutions to the mobile phone industry. Silex's contributions in this effort include high performance metal through-silicon vias for RF applications, PZT piezoelectric thin film technologies for actuator manufacture, and advanced integrated passive devices utilizing through-wafer processing and advanced materials development.
"Silex, as a part of EPAMO, will leverage its expertise in 3D through-wafer processing to develop new MEMS capabilities," says Dr Thorbjorn Ebefors, Chief Technologist at Silex Microsystems. "These new techniques will be used to fabricate high-density integrated inductors, resistors and capacitors for new classes of devices. As the only pure-play foundry involved in EPAMO, Silex is the best positioned foundry to offer these capabilities out to future customers."
EPAMO will develop new advanced wafer materials and RF component designs, combining new thin film materials and thin film technologies with CMOS (Complementary Metal-Oxide-Semiconductor) solutions and advanced 3D packaging technologies. Silex's contributions include piezo-MEMS wafer processing using PZT materials, advanced RF through-silicon vias, and through-wafer integrated passive devices.
EPAMO is coordinated by Dr. Thomas Metzger of EPCOS AG of Germany. EPCOS is the world leader in RF filters and global number two on module solutions for the RF front-end of mobile phones. EPCOS Netherlands N.V. hosts the development and business development of several RF system solutions like antenna tuners, tunable power amplifiers and smart RF front-ends for EPCOS. For more information see www.epamo.eu.
About ENIAC JU
ENIAC JU (European Technology Platform on Nanoelectronics Joint Undertaking), a public-private partnership between the European Commission, 21 European countries and various nanoelectronics actors funds euro 2.2 M of EPAMO budget. National public funding from the participating nations covers euro 5.5 M, and euro 5.6 M comes from EPAMO partners. For more information see www.eniac.eu.
About Silex Microsystems
Silex Microsystems is the world's largest pure-play MEMS foundry. Silex services the advanced MEMS and heterogeneous packaging needs of the world's leading companies. With production operations totaling 25,000 square feet and dedicated lines for both 6″ and 8″ wafers, Silex has successfully completed over 300 MEMS projects with over 100 corporate customers. For more information see www.silexmicrosystems.com.
Silex, Silex Microsystems, and Sil-Via are registered trademarks of Silex Microsystems. All other product or service names are the property of their respective owners. Copyright Silex Microsystems, 2012.
SOURCE Silex Microsystems
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