Semiconductor Advanced Packaging Market to grow by USD 21,157.5 million from 2022 to 2027|Complexity of semiconductor IC is one of the market drivers - Technavio

NEW YORK, July 7, 2023 /PRNewswire/ -- The semiconductor advanced packaging market is set to grow by USD 21,157.5 million from 2022 to 2027 progressing at a CAGR of 8.5% during the forecast period. The report offers an up-to-date analysis regarding the current global market scenario, the latest trends and drivers, and the overall market environment. The complexity of semiconductor IC designs is the major factor notably driving the global semiconductor advanced packaging market growth. The number of characteristics and applications delivered by consumer electronic devices is on the rise as electronic device manufacturers look to differentiate their offerings from those of their competitors. Hence, there has been a rising requirement for multifunctional ICs. Semiconductor device manufacturers have addressed this need by developing new and more complicated architecture and designs for semiconductor ICs. For instance, the development of 3D ICs, which are compact, consume less power and are highly efficient but also have complicated designs and elaborate manufacturing processes. Foundries must invest in the latest equipment to develop advanced production systems in line with the latest developments in the packaging field with the rising complexity of IC design and manufacturing processes. Leading foundries such as TSMC require to guarantee not only the continuous upgrade of their production equipment but also that their packaging systems can carry out production using the latest technologies. Such factors are anticipated to propel the growth of the market during the forecast period. Here is an Exclusive report talking about Market scenarios with a historical period (2017-2021) and a forecast period (2023-2027). Download Sample Report in minutes!

The semiconductor advanced packaging market covers the following areas:

• Semiconductor Advanced Packaging Market Sizing
• Semiconductor Advanced Packaging Market Forecast
• Semiconductor Advanced Packaging Market Analysis

The report on the semiconductor advanced packaging market provides a holistic update, market size and forecast, trends, growth drivers, and challenges, as well as vendor analysis. 

Semiconductor Advanced Packaging Market 2023-2027 - Market Dynamics

Major trends

The integration of semiconductor components in vehicles is an emerging trend supporting the advanced semiconductor packaging market growth. The increasing demand for automation in vehicles as well as the electrification of automobiles, is driving the semiconductor market in this sector. Semiconductor ICs are being used for different purposes in automobiles, such as airbag control, GPS, anti-lock braking systems, displays, infotainment systems, power doors as well as windows, automated driving, and collision detection technology. Moreover, the requirement for these semiconductor devices to be of small size and the right form factor will fuel the demand for advanced packaging solutions from the automotive sector. Also, rising yearly car production numbers generate significant demand for semiconductor devices will have a positive impact on the market growth. Autonomous vehicles incorporate several electronic systems, such as forward collision warning, lane departure warning, smart cameras, and autonomous braking systems and as a result, there is a high demand for automotive ICs such as MCUs, MPUs, memory devices, power management ICs, and radar and RF modules. This, in turn, will boost the growth of the market during the forecast period.

Significant Challenge 

Increased production costs are a major challenge hindering the global semiconductor advanced packaging market growth. Wrapping is one of the factors increasing the production cost. The non-availability of a specific solution to the problem of warping augments the production costs for participants in the market, which, in turn, limits the growth of the market. However, a warpage is described as a distortion where the surface of the molded part does not follow the definite design. The issue of warping happens several times during advanced semiconductor packaging, which could result in the wastage of wafers and ultimately leads to high costs. For example, the issue of warping can happen after the post-module of the reconstituted wafer and also occur after the back grinding of the epoxy mold compound to expose the copper contact pad. Such factors are anticipated to impede the growth of the semiconductor advanced packaging market during the forecast period.

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Semiconductor Advanced Packaging Market 2023-2027: Market Segmentation

The semiconductor advanced packaging market segmentation by type (analog and mixed ICs, MEMs and sensors, logic and memory devices, wireless connectivity devices, and CMOS /image sensors), technology (flip chip, FI WLP, 2.5D/3D, and FO WLP), and geography (APAC, North America, Europe, South America, and Middle east and Africa). 

• The market share growth by the analog and mixed ICs segment will be significant during the forecast period. The expansion in demand for analog ICs from different end-user segments such as communication, consumer electronics, and automotive has been gradual but significant. The growing pace of new product development and the lowering cost per function of ICs have added to the demand for semiconductor ICs (analog ICs). The fast technological developments in the semiconductor industry have led to the development of efficient analog ICs that deliver optimized performance and also resulted in the improved accumulation of analog ICs in the world market. The primary driving factor behind the demand for 3D ICs, FI WLPs, and FO WLPs in the analog and mixed IC segment is the need for advanced packaging solutions to guarantee the robust performance of analog and mixed ICs. Some of the vendors operating in the analog and mixed ICs segment are also developing their product offerings. Such developments can also boost the demand for advanced semiconductor packaging during the forecast period. 

This report presents a detailed picture of the market by way of study, synthesis, and summation of data from multiple sources through an analysis of key parameters- View Sample Report

Companies Mentioned

• Amkor Technology Inc
• ASE Technology Holding Co. Ltd.
• Cactus Materials Inc.
• China Wafer Level CSP Co. Ltd.
• ChipMOS TECHNOLOGIES Inc.
• HANA Micron Co Ltd.
• Intel Corp.
• JCET Group Co. Ltd.
• King Yuan Electronics Co. Ltd.
• Koch Industries Inc.
• Microchip Technology Inc.
• nepes Corp.
• Powertech Technology Inc.
• Samsung Electronics Co. Ltd.
• SIGNETICS
• Taiwan Semiconductor Manufacturing Co. Ltd.
• Tianshui Huatian Technology Co. Ltd.
• TOSHIBA CORP
• UTAC Holdings Ltd.
• Veeco Instruments Inc.

Vendor Offerings

• Amkor Technology Inc - The company offers semiconductor packaging such as thin package formats and BGA packages.
• ASE Technology Holding Co. Ltd. - The company offers semiconductor advanced packaging under semiconductor turnkey solutions.
• Cactus Materials Inc. - The company offers semiconductor advanced packaging such as multipurpose ceramic packages, opto packages, and MEMS packages.

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Key Topics Covered:

1 Executive Summary

• 1.1 Market overview 
• Exhibit 01: Executive Summary – Chart on Market Overview
• Exhibit 02: Executive Summary – Data Table on Market Overview
• Exhibit 03: Executive Summary – Chart on Global Market Characteristics
• Exhibit 04: Executive Summary – Chart on Market by Geography
• Exhibit 05: Executive Summary – Chart on Market Segmentation by Type
• Exhibit 06: Executive Summary – Chart on Market Segmentation by Technology
• Exhibit 07: Executive Summary – Chart on Incremental Growth
• Exhibit 08: Executive Summary – Data Table on Incremental Growth
• Exhibit 09: Executive Summary – Chart on Vendor Market Positioning

2 Market Landscape

• 2.1 Market ecosystem 
• Exhibit 10: Parent market
• Exhibit 11: Market Characteristics

3 Market Sizing

• 3.1 Market definition 
• Exhibit 12: Offerings of vendors included in the market definition

• 3.2 Market segment analysis 
• Exhibit 13: Market segments

• 3.3 Market size 2022 

• 3.4 Market outlook: Forecast for 2022-2027
• Exhibit 14: Chart on Global - Market size and forecast 2022-2027 ($ million)
• Exhibit 15: Data Table on Global - Market size and forecast 2022-2027 ($ million)
• Exhibit 16: Chart on Global Market: Year-over-year growth 2022-2027 (%)
• Exhibit 17: Data Table on Global Market: Year-over-year growth 2022-2027 (%)

4 Historic Market Size

• 4.1 Global semiconductor advanced packaging market 2017 - 2021 
• Exhibit 18: Historic Market Size – Data Table on Global semiconductor advanced packaging market 2017 - 2021 ($ million)

• 4.2 Type Segment Analysis 2017 - 2021 
• Exhibit 19: Historic Market Size – Type Segment 2017 - 2021 ($ million)

• 4.3 Technology Segment Analysis 2017 - 2021
• Exhibit 20: Historic Market Size – Technology Segment 2017 - 2021 ($ million)

• 4.4 Geography Segment Analysis 2017 - 2021
• Exhibit 21: Historic Market Size – Geography Segment 2017 - 2021 ($ million)

• 4.5 Country Segment Analysis 2017 - 2021
• Exhibit 22: Historic Market Size – Country Segment 2017 - 2021 ($ million)

5 Five Forces Analysis

• 5.1 Five forces summary 
• Exhibit 23: Five forces analysis - Comparison between 2022 and 2027

• 5.2 Bargaining power of buyers 
• Exhibit 24: Chart on Bargaining power of buyers – Impact of key factors 2022 and 2027

• 5.3 Bargaining power of suppliers 
• Exhibit 25: Bargaining power of suppliers – Impact of key factors in 2022 and 2027

• 5.4 Threat of new entrants 
• Exhibit 26: Threat of new entrants – Impact of key factors in 2022 and 2027

• 5.5 Threat of substitutes 
• Exhibit 27: Threat of substitutes – Impact of key factors in 2022 and 2027

• 5.6 Threat of rivalry 
• Exhibit 28: Threat of rivalry – Impact of key factors in 2022 and 2027

• 5.7 Market condition 
• Exhibit 29: Chart on Market condition - Five forces 2022 and 2027

6 Market Segmentation by Type

• 6.1 Market segments 
• Exhibit 30: Chart on Type - Market share 2022-2027 (%)
• Exhibit 31: Data Table on Type - Market share 2022-2027 (%)

• 6.2 Comparison by Type 
• Exhibit 32: Chart on Comparison by Type
• Exhibit 33: Data Table on Comparison by Type

• 6.3 Analog and mixed ICs - Market size and forecast 2022-2027 
• Exhibit 34: Chart on Analog and mixed ICs - Market size and forecast 2022-2027 ($ million)
• Exhibit 35: Data Table on Analog and mixed ICs - Market size and forecast 2022-2027 ($ million)
• Exhibit 36: Chart on Analog and mixed ICs - Year-over-year growth 2022-2027 (%)
• Exhibit 37: Data Table on Analog and mixed ICs - Year-over-year growth 2022-2027 (%)

• 6.4 MEMS and sensors - Market size and forecast 2022-2027
• Exhibit 38: Chart on MEMS and sensors - Market size and forecast 2022-2027 ($ million)
• Exhibit 39: Data Table on MEMS and sensors - Market size and forecast 2022-2027 ($ million)
• Exhibit 40: Chart on MEMS and sensors - Year-over-year growth 2022-2027 (%)
• Exhibit 41: Data Table on MEMS and sensors - Year-over-year growth 2022-2027 (%)

• 6.5 Logic and memory devices - Market size and forecast 2022-2027 
• Exhibit 42: Chart on Logic and memory devices - Market size and forecast 2022-2027 ($ million)
• Exhibit 43: Data Table on Logic and memory devices - Market size and forecast 2022-2027 ($ million)
• Exhibit 44: Chart on Logic and memory devices - Year-over-year growth 2022-2027 (%)
• Exhibit 45: Data Table on Logic and memory devices - Year-over-year growth 2022-2027 (%)

• 6.6 Wireless connectivity devices - Market size and forecast 2022-2027 
• Exhibit 46: Chart on Wireless connectivity devices - Market size and forecast 2022-2027 ($ million)
• Exhibit 47: Data Table on Wireless connectivity devices - Market size and forecast 2022-2027 ($ million)
• Exhibit 48: Chart on Wireless connectivity devices - Year-over-year growth 2022-2027 (%)
• Exhibit 49: Data Table on Wireless connectivity devices - Year-over-year growth 2022-2027 (%)

• 6.7 CMOS image sensors - Market size and forecast 2022-2027 
• Exhibit 50: Chart on CMOS image sensors - Market size and forecast 2022-2027 ($ million)
• Exhibit 51: Data Table on CMOS image sensors - Market size and forecast 2022-2027 ($ million)
• Exhibit 52: Chart on CMOS image sensors - Year-over-year growth 2022-2027 (%)
• Exhibit 53: Data Table on CMOS image sensors - Year-over-year growth 2022-2027 (%)

• 6.8 Market opportunity by Type 
• Exhibit 54: Market opportunity by Type ($ million)

7 Market Segmentation by Technology

• 7.1 Market segments 
• Exhibit 55: Chart on Technology - Market share 2022-2027 (%)
• Exhibit 56: Data Table on Technology - Market share 2022-2027 (%)

• 7.2 Comparison by Technology 
• Exhibit 57: Chart on Comparison by Technology
• Exhibit 58: Data Table on Comparison by Technology

• 7.3 Flip chip - Market size and forecast 2022-2027
• Exhibit 59: Chart on Flip chip - Market size and forecast 2022-2027 ($ million)
• Exhibit 60: Data Table on Flip chip - Market size and forecast 2022-2027 ($ million)
• Exhibit 61: Chart on Flip chip - Year-over-year growth 2022-2027 (%)
• Exhibit 62: Data Table on Flip chip - Year-over-year growth 2022-2027 (%)

• 7.4 FI WLP - Market size and forecast 2022-2027
• Exhibit 63: Chart on FI WLP - Market size and forecast 2022-2027 ($ million)
• Exhibit 64: Data Table on FI WLP - Market size and forecast 2022-2027 ($ million)
• Exhibit 65: Chart on FI WLP - Year-over-year growth 2022-2027 (%)
• Exhibit 66: Data Table on FI WLP - Year-over-year growth 2022-2027 (%)

• 7.5 2.5D/3D - Market size and forecast 2022-2027
• Exhibit 67: Chart on 2.5D/3D - Market size and forecast 2022-2027 ($ million)
• Exhibit 68: Data Table on 2.5D/3D - Market size and forecast 2022-2027 ($ million)
• Exhibit 69: Chart on 2.5D/3D - Year-over-year growth 2022-2027 (%)
• Exhibit 70: Data Table on 2.5D/3D - Year-over-year growth 2022-2027 (%)

• 7.6 FO WLP - Market size and forecast 2022-2027
• Exhibit 71: Chart on FO WLP - Market size and forecast 2022-2027 ($ million)
• Exhibit 72: Data Table on FO WLP - Market size and forecast 2022-2027 ($ million)
• Exhibit 73: Chart on FO WLP - Year-over-year growth 2022-2027 (%)
• Exhibit 74: Data Table on FO WLP - Year-over-year growth 2022-2027 (%)

• 7.7 Market opportunity by Technology 
• Exhibit 75: Market opportunity by Technology ($ million)

8 Customer Landscape

• 8.1 Customer landscape overview 
• Exhibit 76: Analysis of price sensitivity, lifecycle, customer purchase basket, adoption rates, and purchase criteria

9 Geographic Landscape

• 9.1 Geographic segmentation 
• Exhibit 77: Chart on Market share by geography 2022-2027 (%)
• Exhibit 78: Data Table on Market share by geography 2022-2027 (%)

• 9.2 Geographic comparison 
• Exhibit 79: Chart on Geographic comparison
• Exhibit 80: Data Table on Geographic comparison

• 9.3 APAC - Market size and forecast 2022-2027
• Exhibit 81: Chart on APAC - Market size and forecast 2022-2027 ($ million)
• Exhibit 82: Data Table on APAC - Market size and forecast 2022-2027 ($ million)
• Exhibit 83: Chart on APAC - Year-over-year growth 2022-2027 (%)
• Exhibit 84: Data Table on APAC - Year-over-year growth 2022-2027 (%)

• 9.4 North America - Market size and forecast 2022-2027
• Exhibit 85: Chart on North America - Market size and forecast 2022-2027 ($ million)
• Exhibit 86: Data Table on North America - Market size and forecast 2022-2027 ($ million)
• Exhibit 87: Chart on North America - Year-over-year growth 2022-2027 (%)
• Exhibit 88: Data Table on North America - Year-over-year growth 2022-2027 (%)

• 9.5 Europe - Market size and forecast 2022-2027
• Exhibit 89: Chart on Europe - Market size and forecast 2022-2027 ($ million)
• Exhibit 90: Data Table on Europe - Market size and forecast 2022-2027 ($ million)
• Exhibit 91: Chart on Europe - Year-over-year growth 2022-2027 (%)
• Exhibit 92: Data Table on Europe - Year-over-year growth 2022-2027 (%)

• 9.6 South America - Market size and forecast 2022-2027
• Exhibit 93: Chart on South America - Market size and forecast 2022-2027 ($ million)
• Exhibit 94: Data Table on South America - Market size and forecast 2022-2027 ($ million)
• Exhibit 95: Chart on South America - Year-over-year growth 2022-2027 (%)
• Exhibit 96: Data Table on South America - Year-over-year growth 2022-2027 (%)

• 9.7 Middle East and Africa - Market size and forecast 2022-2027 
• Exhibit 97: Chart on Middle East and Africa - Market size and forecast 2022-2027 ($ million)
• Exhibit 98: Data Table on Middle East and Africa - Market size and forecast 2022-2027 ($ million)
• Exhibit 99: Chart on Middle East and Africa - Year-over-year growth 2022-2027 (%)
• Exhibit 100: Data Table on Middle East and Africa - Year-over-year growth 2022-2027 (%)

• 9.8 China - Market size and forecast 2022-2027
• Exhibit 101: Chart on China - Market size and forecast 2022-2027 ($ million)
• Exhibit 102: Data Table on China - Market size and forecast 2022-2027 ($ million)
• Exhibit 103: Chart on China - Year-over-year growth 2022-2027 (%)
• Exhibit 104: Data Table on China - Year-over-year growth 2022-2027 (%)

• 9.9 US - Market size and forecast 2022-2027
• Exhibit 105: Chart on US - Market size and forecast 2022-2027 ($ million)
• Exhibit 106: Data Table on US - Market size and forecast 2022-2027 ($ million)
• Exhibit 107: Chart on US - Year-over-year growth 2022-2027 (%)
• Exhibit 108: Data Table on US - Year-over-year growth 2022-2027 (%)

• 9.10 Germany - Market size and forecast 2022-2027
• Exhibit 109: Chart on Germany - Market size and forecast 2022-2027 ($ million)
• Exhibit 110: Data Table on Germany - Market size and forecast 2022-2027 ($ million)
• Exhibit 111: Chart on Germany - Year-over-year growth 2022-2027 (%)
• Exhibit 112: Data Table on Germany - Year-over-year growth 2022-2027 (%)

• 9.11 Japan - Market size and forecast 2022-2027
• Exhibit 113: Chart on Japan - Market size and forecast 2022-2027 ($ million)
• Exhibit 114: Data Table on Japan - Market size and forecast 2022-2027 ($ million)
• Exhibit 115: Chart on Japan - Year-over-year growth 2022-2027 (%)
• Exhibit 116: Data Table on Japan - Year-over-year growth 2022-2027 (%)

• 9.12 Canada - Market size and forecast 2022-2027
• Exhibit 117: Chart on Canada - Market size and forecast 2022-2027 ($ million)
• Exhibit 118: Data Table on Canada - Market size and forecast 2022-2027 ($ million)
• Exhibit 119: Chart on Canada - Year-over-year growth 2022-2027 (%)
• Exhibit 120: Data Table on Canada - Year-over-year growth 2022-2027 (%)

• 9.13 India - Market size and forecast 2022-2027
• Exhibit 121: Chart on India - Market size and forecast 2022-2027 ($ million)
• Exhibit 122: Data Table on India - Market size and forecast 2022-2027 ($ million)
• Exhibit 123: Chart on India - Year-over-year growth 2022-2027 (%)
• Exhibit 124: Data Table on India - Year-over-year growth 2022-2027 (%)

• 9.14 Market opportunity by geography 
• Exhibit 125: Market opportunity by geography ($ million)

10 Drivers, Challenges, and Trends

• 10.1 Market drivers 

• 10.2 Market challenges 

• 10.3 Impact of drivers and challenges 
• Exhibit 126: Impact of drivers and challenges in 2022 and 2027

• 10.4 Market trends 

11 Vendor Landscape

• 11.1 Overview 

• 11.2 Vendor landscape 
• Exhibit 127: Overview on Criticality of inputs and Factors of differentiation

• 11.3 Landscape disruption 
• Exhibit 128: Overview on factors of disruption

• 11.4 Industry risks 
• Exhibit 129: Impact of key risks on business

12 Vendor Analysis

• 12.1 Vendors covered 
• Exhibit 130: Vendors covered

• 12.2 Market positioning of vendors 
• Exhibit 131: Matrix on vendor position and classification

• 12.3 Amkor Technology Inc 
• Exhibit 132: Amkor Technology Inc - Overview
• Exhibit 133: Amkor Technology Inc - Business segments
• Exhibit 134: Amkor Technology Inc - Key offerings
• Exhibit 135: Amkor Technology Inc - Segment focus

• 12.4 ASE Technology Holding Co. Ltd. 
• Exhibit 136: ASE Technology Holding Co. Ltd. - Overview
• Exhibit 137: ASE Technology Holding Co. Ltd. - Business segments
• Exhibit 138: ASE Technology Holding Co. Ltd. - Key news
• Exhibit 139: ASE Technology Holding Co. Ltd. - Key offerings
• Exhibit 140: ASE Technology Holding Co. Ltd. - Segment focus

• 12.5 Cactus Materials Inc. 
• Exhibit 141: Cactus Materials Inc. - Overview
• Exhibit 142: Cactus Materials Inc. - Product / Service
• Exhibit 143: Cactus Materials Inc. - Key offerings

• 12.6 China Wafer Level CSP Co. Ltd. 
• Exhibit 144: China Wafer Level CSP Co. Ltd. - Overview
• Exhibit 145: China Wafer Level CSP Co. Ltd. - Product / Service
• Exhibit 146: China Wafer Level CSP Co. Ltd. - Key offerings

• 12.7 ChipMOS TECHNOLOGIES Inc. 
• Exhibit 147: ChipMOS TECHNOLOGIES Inc. - Overview
• Exhibit 148: ChipMOS TECHNOLOGIES Inc. - Business segments
• Exhibit 149: ChipMOS TECHNOLOGIES Inc. - Key offerings
• Exhibit 150: ChipMOS TECHNOLOGIES Inc. - Segment focus

• 12.8 HANA Micron Co Ltd. 
• Exhibit 151: HANA Micron Co Ltd. - Overview
• Exhibit 152: HANA Micron Co Ltd. - Business segments
• Exhibit 153: HANA Micron Co Ltd. - Key offerings
• Exhibit 154: HANA Micron Co Ltd. - Segment focus

• 12.9 JCET Group Co. Ltd. 
• Exhibit 155: JCET Group Co. Ltd. - Overview
• Exhibit 156: JCET Group Co. Ltd. - Product / Service
• Exhibit 157: JCET Group Co. Ltd. - Key offerings

• 12.10 King Yuan Electronics Co. Ltd. 
• Exhibit 158: King Yuan Electronics Co. Ltd. - Overview
• Exhibit 159: King Yuan Electronics Co. Ltd. - Business segments
• Exhibit 160: King Yuan Electronics Co. Ltd. - Key offerings
• Exhibit 161: King Yuan Electronics Co. Ltd. - Segment focus

• 12.11 nepes Corp. 
• Exhibit 162: nepes Corp. - Overview
• Exhibit 163: nepes Corp. - Product / Service
• Exhibit 164: nepes Corp. - Key offerings

• 12.12 Powertech Technology Inc. 
• Exhibit 165: Powertech Technology Inc. - Overview
• Exhibit 166: Powertech Technology Inc. - Business segments
• Exhibit 167: Powertech Technology Inc. - Key offerings
• Exhibit 168: Powertech Technology Inc. - Segment focus

• 12.13 Samsung Electronics Co. Ltd. 
• Exhibit 169: Samsung Electronics Co. Ltd. - Overview
• Exhibit 170: Samsung Electronics Co. Ltd. - Business segments
• Exhibit 171: Samsung Electronics Co. Ltd. - Key news
• Exhibit 172: Samsung Electronics Co. Ltd. - Key offerings
• Exhibit 173: Samsung Electronics Co. Ltd. - Segment focus

• 12.14 SIGNETICS 
• Exhibit 174: SIGNETICS - Overview
• Exhibit 175: SIGNETICS - Product / Service
• Exhibit 176: SIGNETICS - Key offerings

• 12.15 Taiwan Semiconductor Manufacturing Co. Ltd. 
• Exhibit 177: Taiwan Semiconductor Manufacturing Co. Ltd. - Overview
• Exhibit 178: Taiwan Semiconductor Manufacturing Co. Ltd. - Product / Service
• Exhibit 179: Taiwan Semiconductor Manufacturing Co. Ltd. - Key offerings

• 12.16 UTAC Holdings Ltd. 
• Exhibit 180: UTAC Holdings Ltd. - Overview
• Exhibit 181: UTAC Holdings Ltd. - Product / Service
• Exhibit 182: UTAC Holdings Ltd. - Key offerings

• 12.17 Veeco Instruments Inc. 
• Exhibit 183: Veeco Instruments Inc. - Overview
• Exhibit 184: Veeco Instruments Inc. - Product / Service
• Exhibit 185: Veeco Instruments Inc. - Key news
• Exhibit 186: Veeco Instruments Inc. - Key offerings

13 Appendix

• 13.1 Scope of the report 

• 13.2 Inclusions and exclusions checklist
• Exhibit 187: Inclusions checklist
• Exhibit 188: Exclusions checklist

• 13.3 Currency conversion rates for US$ 
• Exhibit 189: Currency conversion rates for US$

• 13.4 Research methodology 
• Exhibit 190: Research methodology
• Exhibit 191: Validation techniques employed for market sizing
• Exhibit 192: Information sources

• 13.5 List of abbreviations 
• Exhibit 193: List of abbreviations

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