Toshiba Ships Industry's First Dual Camera Module Able To Simultaneously Output Recorded Images And Depth Data

LAS VEGAS, Jan. 7, 2014 /PRNewswire/ -- CONSUMER ELECTRONICS SHOW (CES) -- Toshiba America Electronic Components, Inc. (TAEC)*, a committed leader that collaborates with technology companies to create breakthrough designs, today makes available sample quantities of its TCM9518MD, the industry's first¹ dual camera module able to simultaneously output recorded images and depth data for smartphones, tablets and mobile devices. The TCM9518MD's twin camera modules and a dedicated companion LSI chip simultaneously deliver deep focus images in which foreground and background, and all points in between, are in focus with depth data provided for each object in the picture. The dual camera module will be demonstrated this week at the CES 2014 show in Las Vegas, Nevada.

(Photo: http://photos.prnewswire.com/prnh/20140107/SF40356)

"We expect the TCM9518MD to drive new applications for smartphone, tablets and mobile devices including refocus and defocus; highlighting objects in a scene and then editing, cropping etc.; as well as image and gesture operation," says Andrew Burt, vice president of the Image Sensor Business Unit, System LSI Group at TAEC. "Not only does the dual camera module enable these advanced capabilities with fast digital focus and little shutter lag, the device doesn't require any focus motors, so it can be built much thinner than today's 13-megapixel camera modules."

The TCM9518MD incorporates twin 1/4 inch optical format 5-megapixel CMOS camera modules (5 megapixels x 2 arrays). The dedicated companion LSI chip of the TCM9518MD measures and appends depth data to objects in the image. This data can be used for a variety of applications. The LSI also generates 13-megapixel images by up scaling images taken by the twin 5-megapixel cameras, resulting in a lower module height than that of conventional 13 megapixel camera modules².

Computational cameras create images impossible to realize with the standard camera module by combining optical hardware technology—the lens and diaphragm—with digital signal processing technology. The TCM9518MD brings high resolution and computational camera functionalities to the CMOS image sensor market for smartphones, tablets and mobile devices.

Product Demonstration at CES
Product demonstrations are by appointment only. To schedule a demonstration please send an email to [email protected] and include your name, title, company, preferred date/time at the show, as well as a phone number.

Availability/Pricing
Sample shipments of the TCM9518MD are now available. Price is $50 (U.S.)

*About TAEC
Through proven commitment, lasting relationships and advanced, reliable electronic components, Toshiba enables its customers to create market-leading designs. Toshiba is the heartbeat within product breakthroughs from OEMs, ODMs, CMs, VARs, distributors and fabless chip companies worldwide. A committed electronic components leader, Toshiba designs and manufactures high-quality flash memory-based storage solutions, solid state drives (SSDs), hard disk drives (HDDs), solid state hybrid drives (SSHDs), discrete devices, advanced materials, medical tubes, custom SoCs/ASICs, imaging products, microcontrollers and wireless components that make possible today's leading smartphones, tablets, cameras, medical devices, automotive electronics, enterprise solutions and more.

Toshiba America Electronic Components, Inc. is an independent operating company owned by Toshiba America, Inc., a subsidiary of Toshiba Corporation, Japan's largest semiconductor manufacturer and the world's fifth largest semiconductor manufacturer (Gartner, 2012 Worldwide Semiconductor Revenue, April, 2013). Toshiba Corporation was founded in 1875 and today has over 554 subsidiaries and affiliates, with 210,000 employees worldwide. Visit Toshiba's web site at www.toshiba.co.jp/index.htm.

Information in this press release, including product pricing and specifications, content of services and contact information, is current and believed to be accurate on the date of the announcement, but is subject to change without prior notice. Technical and application information contained here is subject to the most recent applicable Toshiba product specifications. In developing designs, please ensure that Toshiba products are used within specified operating ranges as set forth in the most recent Toshiba product specifications and the information set forth in Toshiba's "Handling Guide for Semiconductor Devices," or "Toshiba Semiconductor Reliability Handbook." This information is available at http://www.toshiba.com/taec/support/techquestions/index.jsp or from your TAEC representative.

Notes:

1. For dual camera module with the companion LSI which output depth data. Source: Toshiba, as of September 2013.
2. Generally for single camera modules, a bigger output image size requires a higher camera module. This product is lower than commercial 13 megapixel camera modules. Source: Toshiba, as of September 2013.

SOURCE Toshiba America Electronic Components, Inc.

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