Reportlinker Adds Energy Harvesting and Storage for Electronic Devices 2009-2019

NEW YORK, May 4 /PRNewswire/ -- Reportlinker.com announces that a new market research report is available in its catalogue:

Energy Harvesting and Storage for Electronic Devices 2009-2019

http://www.reportlinker.com/p0191580/Energy-Harvesting-and-Storage-for-Electronic-Devices-2009-2019.html

Energy harvesting is otherwise known as power harvesting or energy scavenging. It is the use of ambient energy to power small electronic or electrical devices. That means solar cells on satellites, heat powered sensors buried in engines, vibration harvesting for helicopter electronics and the wind- up radio or lantern. However, there are also several more esoteric options.

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Energy harvesting is otherwise known as power harvesting or energy scavenging. It is the use of ambient energy to power small electronic or electrical devices. That means solar cells on satellites, heat powered sensors buried in engines, vibration harvesting for helicopter electronics and the wind- up radio or lantern. However, there are also several more esoteric options.

Energy harvesting has reached a tipping point. This is because the necessary lower power electronics and more efficient energy gathering and storage are now sufficiently affordable, reliable and longer lived for a huge number of applications to be practicable. From wind-up laptops for Africa to the wireless light switch working from the power of your finger, these things are either available or imminently available. And photovoltaics, long used in aerospace, has come down-market, even to road furniture but it has much further to go even to disposable solar film and even solar paint. The first solar powered watches and phones have appeared. Some new photovoltaic technologies are printed reel to reel at low cost, the resulting film working off heat as well as light. For example, Sony is commercialising flexible solar cells for indoor use.

However, there are further mountains to climb from self powered wireless sensors monitoring forest fires, pollution spillages and even inside the human body and in the concrete of buildings. These applications will become commonplace one day. Even devices with maintenance-free life of hundreds of years can now be envisaged. Meanwhile, bionic man containing maintenance free, self-powered devices for his lifetime is an objective for the next few years.

How do these things work? Which technologies have the most potential now and in the future? What are the advantages and disadvantages of each? Which countries have the most active programs and why? What are the leading universities, developers, manufacturers and other players up to? What alliances exist? What are the timelines for success? All these questions and more are answered in this report.

First prepared in late 2008/ early 2009, is the fruit of global visits, literature searches and interviews by technically qualified IDTechEx staff. IDTechEx stages the largest conferences in three continents on Printed Electronics and the only major conferences on Real Time Locating Systems/Wireless Sensor Networks and Photovoltaics beyond Conventional Silicon, plus a major RFID conference. These and its widespread technical and marketing consultancy business provides unique insight into what is happening and about to happen. IDTechEx has offices in the USA, UK, Germany, Poland and New Zealand and is setting up an office in Japan. Its staff speak many languages, travel intensively and are well placed to see the future.

EXECUTIVE SUMMARY AND CONCLUSIONS

1. INTRODUCTION

1.1. What is energy harvesting?

1.2. What it is not

1.3. Power requirements of different devices

1.4. Harvesting options to meet these requirements

1.5. Battery advances fail to keep up - implications

1.6. Some key enablers for the future - printed electronics, smart substrates, MEMS

1.6.1. Printed and thin film

1.6.2. Smart substrates

1.6.3. MEMS

2. APPLICATIONS AND POTENTIAL APPLICATIONS

2.1. Aerospace and military

2.2. Industrial

2.2.1. Standards - EnOcean Alliance and Buildings

2.2.2. Real Time Locating Systems

2.2.3. Wireless Sensor Networks (WSN)

2.2.4. Aircraft, engines and machinery

2.3. Consumer

2.3.1. Mobile phones, wristwatches, radio, lamps etc

2.3.2. E-Labels, E-Packaging, E-signage, E-posters

2.4. Healthcare

2.5. Third World

2.6. Environmental

3. HARVESTING-TOLERANT ELECTRONICS, DIRECT USE OF POWER, STORAGE OPTIONS

3.1. Harvesting tolerant electronics and direct use of power

3.1.1. Progress with harvesting tolerant electronics

3.2. New battery options

3.2.1. Smart Dust

3.2.2. Lithium laminar batteries

3.2.3. Planar Energy Devices

3.2.4. Cymbet Corporation - integrated battery management

3.2.5. Transparent printed organic batteries

3.2.6. Biobatteries do their own harvesting

3.2.7. Need for shape standards for laminar batteries

3.3. Alternatives to batteries

3.3.1. Supercapacitors

3.3.2. Supercabatteries

3.3.3. Mini fuel cells

4. LIGHT HARVESTING FOR SMALL DEVICES

4.1. Comparison of options

4.1.1. Important parameters

4.1.2. Principles of operation

4.1.3. Options for the future

4.1.4. Many types of photovoltaics needed for harvesting

4.2. Limits of cSi and aSi technologies

4.3. Limits of CdTe

4.4. GaAsGe multilayers

4.5. DSSC

4.6. CIGS

4.7. Organic

4.8. Nanosilicon ink

4.9. Nantennas

4.10. Other options

4.10.1. Nanowire solar cells

5. MOVEMENT HARVESTING

5.1. Vibration harvesting

5.2. Movement harvesting options

5.2.1. Piezoelectric - conventional, ZnO and polymer

5.2.2. Electrostatic

5.2.3. Magnetostrictive

5.2.4. Energy harvesting electronics

5.3. Electroactive polymers

5.4. MEMS

5.5. Electrodynamic

6. HEAT HARVESTING

6.1. Thermoelectrics

6.1.1. Thermoelectric construction

6.1.2. Advantages of thermoelectrics

6.1.3. Heat pumps

7. OTHER HARVESTING OPTIONS

7.1. Electromagnetic field harnessing

7.2. Microbial and other fuel cells

8. PROFILES OF 200 PARTICIPANTS IN 22 COUNTRIES

8.1. Active Business Company GmbH

8.2. AdaptivEnergy

8.3. AdHoc Electronics

8.4. Advanced Cerametrics

8.5. Agency for Defense Development

8.6. AIST Tsukuba

8.7. Alabama A.&M. University

8.8. Alps Electric

8.9. Alvi Technologies

8.10. Ambient Research

8.11. AmbioSystems LLC

8.12. Applied Digital Solutions

8.13. Argonne National Laboratory

8.14. Arizona State University

8.15. Australian National University - Department of Engineering

8.16. BAE Systems

8.17. Biberach University of Applied Sciences

8.18. bk-electronic GmbH

8.19. BootUp GmbH

8.20. BSC Computer GmbH

8.21. California Institute of Technology

8.22. California Institute of Technology/Jet Propulsion Laboratory

8.23. California State University - Northridge

8.24. Carnegie Mellon University

8.25. CEA (Atomic Energy Commission of France)

8.26. Chinese University of Hong Kong

8.27. Chungbuk National University

8.28. Citizen Holding Co Ltd

8.29. China National Space Administration

8.30. Clarkson University

8.31. Cymtox Ltd

8.32. DigiTower Cologne

8.33. Distech Controls

8.34. Drexel University

8.35. East Japan Railway Company

8.36. EchoFlex Solutions

8.37. EDF R&D

8.38. Electronics and Telecommunications Research Institute (ETRI)

8.39. Eltako GmbH

8.40. Ember Corporation

8.41. Encrea srl

8.42. Energie Agentur

8.43. Engenuity Systems

8.44. EnOcean GmbH

8.45. European Space Agency

8.46. Exergen

8.47. Fast Trak Ltd

8.48. Fatih University

8.49. Ferro Solutions, Inc.

8.50. Fraunhofer Institut Integrierte Schaltungen

8.51. Freeplay Foundation

8.52. G24 Innovations

8.53. Ganssle Group

8.54. Georgia Institute of Technology

8.55. GreenPeak Technologies

8.56. Harvard University

8.57. High Merit Thermoelectrics

8.58. Hi-Tech Wealth

8.59. Holst Centre

8.60. Honeywell

8.61. Idaho National Laboratory

8.62. IMEC

8.63. Imperial College

8.64. India Space Research Organisation

8.65. Ingenieurbüro Zink GmbH

8.66. INGLAS Innovative Glassysteme GmbH & Co. KG

8.67. INSYS Electronics

8.68. IntAct

8.69. Intel

8.70. ITRI (Industrial Technology Research Institute)

8.71. Jager Direkt GmbH & Co

8.72. Japan Aerospace Exploration Agency

8.73. Kanazawa University

8.74. KCF Technologies Inc

8.75. KIB Projekt GmbH

8.76. Kinetron BV

8.77. Kobe University

8.78. Konarka

8.79. Kookmin University,

8.80. Korea Electronics Company

8.81. Korea Institute of Science and Technology

8.82. Korea University

8.83. KVL Comp Ltd.

8.84. Lawrence Livermore National Laboratory

8.85. Lebônê Solutions

8.86. LessWire, LLC

8.87. Leviton

8.88. LonMark International

8.89. Masco

8.90. Massachusetts Institute of Technology

8.91. MEMSCAP SA

8.92. Michigan Technological University

8.93. Microdul AG

8.94. Micropelt GmbH

8.95. MicroStrain Inc.,

8.96. Midé Technology Corporation

8.97. MINIWIZ Sustainable Energy Dev. Ltd

8.98. Mitsubishi Corporation

8.99. MK Electric (a Honeywell Business)

8.100. Moritani and Co Ltd

8.101. Nanosonic Inc

8.102. NASA

8.103. National Physical Laboratory

8.104. National Semiconductor

8.105. National Taiwan University,

8.106. National Tsing Hua University

8.107. Network Rail Infrastructure Ltd

8.108. Newcastle University

8.109. Nextreme

8.110. Nokia Cambridge UK Research Centre

8.111. North Carolina State University

8.112. Northrop Grumman

8.113. Northeastern University

8.114. Northwestern University

8.115. Nova Mems

8.116. NTT DOCOMO

8.117. Oak Ridge National Laboratory

8.118. Ohio State University

8.119. Omnio

8.120. Omron Corporation

8.121. Orkit Building Intelligence

8.122. Osram

8.123. Osram Silvania

8.124. Pacific Northwest National Laboratory

8.125. PEHA

8.126. Pennsylvania State University

8.127. Perpetuum Ltd

8.128. PowerFilm, Inc.

8.129. PROBARE Thomas Rieder e.K.

8.130. PulseSwitch Systems

8.131. Purdue University

8.132. PYRECAP/HYCOSYS

8.133. Regulvar

8.134. Rockwell Automation

8.135. Rutherford Appleton Laboratory,

8.136. Sagentia

8.137. Sandia National Laboratory,

8.138. Satellite Services Ltd

8.139. SAT System- und Anlagentechnik Herbert GmbH

8.140. Sauter

8.141. Schulte Elektrotechnik GmbH & Co. KG

8.142. Scuola Superiore Sant'Anna

8.143. Seiko

8.144. SELEX Galileo

8.145. SensorDynamics AG

8.146. Sentilla Corporation

8.147. Servodan A/S

8.148. Shanghai Jiao Tong University

8.149. Siemens Building Technologies GmbH & Co

8.150. Simon Fraser University

8.151. Smart Material Corp.

8.152. SMH

8.153. Solid State Research inc

8.154. Sony

8.155. Southampton University Hospital

8.156. Spectrolab Inc

8.157. State University of New Jersey

8.158. Steinbeis Transferzentrum für Embedded Design und Networking

8.159. steute Schaltgeräte GmbH & Co. KG

8.160. Swiss Federal Institute of Technology

8.161. Syngenta Sensors UIC

8.162. Tambient

8.163. Technical University of Ilmenau,

8.164. Technograph Microcircuits Ltd

8.165. Texas Instruments

8.166. ThermoKon Sensortechnik

8.167. Thermolife Energy Corporation

8.168. The Technology Partnership

8.169. TIMA Laboratory

8.170. Tokyo Institute of Technology

8.171. TRW Conekt

8.172. Tyndall National Institute

8.173. Unitronic AG Zentrale

8.174. University of Berlin

8.175. University of Bristol

8.176. University of California Berkeley

8.177. University of California Los Angeles

8.178. University of Edinburgh

8.179. University of Florida

8.180. University of Freiburg - IMTEK

8.181. University of Idaho

8.182. Unive

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