NEW YORK, June 6, 2012 /PRNewswire/ -- Reportlinker.com announces that a new market research report is available in its catalogue:
Global System-On-A-Chip Industry
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This report analyzes the worldwide markets for System-On-A-Chip in US$ Million. The global market is analyzed for following End-Use Segments: Computers, Communication Equipment, Consumer Electronic Devices, Automotive Applications, and Others (Including Industrial Automation, Military, Medical and Other Applications). The report also analyzes the global market for SOCs by the following Two Major Types: SoCs Based on Standard Cell, and SoCs Based on Embedded IP.The report provides separate comprehensive analytics for the US, Canada, Japan, Europe, Asia-Pacific, and Rest of World. Annual estimates and forecasts are provided for the period 2009 through 2017. Also, a six-year historic analysis is provided for these markets. The report profiles 191 companies including many key and niche players such as Microsemi SoC Products Group, Altera Corporation, ARM Holdings Plc, Broadcom Corporation, Freescale Semiconductor, Inc., GCT Semiconductor Inc., Infineon Technologies AG, Intel Corporation, LSI Corporation, Marvell Technology Group Ltd., Panasonic Corporation, Mentor Graphics Corporation, Renesas Electronics Corporation, NVIDIA Corporation, Palmchip Corporation, Samsung Electronics Co., Ltd., STMicroelectronics N.V., Synopsys, Inc., Taiwan Semiconductor Manufacturing Co., Ltd., Texas Instruments Inc Toshiba America Electronics Components, Inc., Xilinx Inc., Zilog Inc., ON Semiconductors Corporation, and Ziptronix, Inc. Market data and analytics are derived from primary and secondary research. Company profiles are primarily based upon search engine sources in the public domain.I. INTRODUCTION, METHODOLOGY & PRODUCT DEFINITIONSStudy Reliability and Reporting Limitations I-1Disclaimers I-2Data Interpretation & Reporting Level I-3Quantitative Techniques & Analytics I-3Product Definitions and Scope of Study I-3II. EXECUTIVE SUMMARY
1. INDUSTRY OVERVIEW II-1
Semiconductor and IC Industry: A Rudimentary Overview II-1
Developments in ICs Over the Years II-1
System-on-A-Chip (SoC): A Major Breakthrough in Semiconductor
Industry II-2
Market Overview II-2
Increasing Need for Compactness and High Speed Performance -
Rationale for Adoption of SoCs in Electronics Industry II-3
Market Scenario II-3
2007-2009 Recession in Restrospect: Instability of the Chip
Industry Echoes Downstream into the SoC Market II-3
Recovery Gets Underway in the Year 2010 II-4
Impact of European Debt Crisis: A Review II-5
Outlook II-6
Computers and Consumer Electronics - Primary Revenue
Contributors II-6
Use of SoCs in Communication Equipment Gains Traction II-7
Wide Application of SoCs in Mobile Phones and Broadband
Networks II-7
SoCs Market Embracing New Changes in Design Methodology II-8
Developments in Multiple Systems-on-a-Chip Augurs Well for SoC
Market II-8
Key Growth Drivers II-9
New End-Use Devices Spark Up SoCs Market II-9
Standardization to Drive the Market II-9
Innovations to Drive Growth II-10
Advent of Three-Dimensional Chips to Boost the Market II-10
Appeal of 3D Chip Soars Among End-Use Sectors II-11
Competitive Overview II-11
Historic Statistical Findings: A Review II-12
Table 1: Global Hard Disk Drives (HDD) SoCs Market (2005):
Market Share Breakdown by Company for Agere, Marvell and
STMicroelectronics (includes corresponding Graph/Chart) II-12
Table 2: Global Programmable Logic Device (PLD) Market(2005): Percentage Share Breakdown by Company for Xilinx,Altera and Others (includes corresponding Graph/Chart) II-12
2. MARKET TRENDS & CHALLENGES II-13
Increasing Usage of SoC Solutions in Medical Field II-13
Growing Demand for 90-nm Technology II-13
Customization to Meet Client's Requirements II-13
Customizable Analog IPs Add New Dimension to Complex SoCs II-14
Embedded Software to Power System-on-a-Chip (SoC) Solutions II-14
Advanced ESL Design-for-Verification Solution to Reduce
Verification Time for Complex SoCs II-15
Dual-Core Processors Gain Ground II-15
SoC IP Designs Witness Rising Demand II-15
ASIC Designs for Supersystems Make a Foray II-16
Development of IP Market II-16
Emergence of System-above-Chip (SaC) Market II-16
Advent of Lab-on-a-Chip (LoC) Technology II-17
Development of Reusable IPs II-17
Innovations Address Power Leakage and Multiple Tasks Handling II-17
Multi-Tasking Microprocessors Gain Significance II-18
EDA and Silicon Intellectual-Property (IP), Two Burgeoning
Sectors II-18
FPGA Makes Inroads in the Semiconductor Chips Market II-19
Development of Premanufactured ASICs, and Flash-and SRAM-
Series of FPGAs II-19
Innovative Design Configuration of FPGAs II-19
Emergence of Three-Tier Design Approach of FPGA-Based Chips II-20
Evolution of System-On-A-Programmable Chip (SOPC) II-20
Standard Logic and Interface Equipment Prevails II-20
Compact Size of Logic Devices Favors Growth II-21
Key Challenges II-21
High Costs, a Major Deterrent II-21
Time-to-Market Pressures II-22
Verification Challenges II-22
Testers - A Solution to the Challenge II-23
IP Compatibility Issue II-24
Issues Related to Marketing of ICs II-24
Customer & Software Support and Staffing Challenges II-24
System-in-Package (SiP) : A Potential Threat to System-on-a-Chip II-25
SiP Market II-25
3. SEMICONDUCTOR INDUSTRY OVERVIEW II-26Global Semiconductor Industry - An Overview II-26The Moore's Law Gives Rise to Sophisticated, Faster andCheaper Chips II-26Technology Advancements Provide Necessary Impetus II-26Semiconductor Industry by Geographic Markets II-26Asia and the US - Two Major Semiconductors Market II-26Leading Semiconductor Players II-27Table 3: World Market for Semiconductors (2009): Breakdown ofRevenue of Top 20 Players (In US$ Billion) (includescorresponding Graph/Chart) II-27
Table 4: Global Semiconductors Market (2008): Percentage
Market Share Breakdown by End-Use Segment (includes
corresponding Graph/Chart) II-28
MEMS Market II-28
4. PRODUCT OVERVIEW II-29SoC - Emerging Technology in the Global Semiconductor Industry II-29Components of SoC II-29System-on-a-Chip (SoC) Block Diagram II-29SoC Design Benefits II-30"Second-Generation" SoCs II-30ASIC SSOC - A New Dimension II-30SoC Device Types II-30Standard Cells II-30Embedded IP II-31Micro Logic IP II-31Memory IP II-31ASIC/PLD IP II-31Analog IP & Other Components II-31Standards For SOCs II-31SoC Processor Types II-32Soft Instruction Processors II-32Configurable Processors II-32Total Design Strategies for SoC II-32Architecture Strategy II-33Design-for-Test Strategy II-33Validation Strategy II-33Synthesis and Back-End Strategy II-33Integration Strategy II-34
5. SOC END-USE APPLICATIONS II-35
Computers II-35
Communications Equipment II-35
Consumer Electronics Devices II-35
Automotive Applications II-35
Others II-36
Industrial Automation & Military II-36
Medical & Office Devices II-36
CRM and Hearing Aid Products Dominate the Category II-36
New Mixed-Signal Radio-Frequency (RF) Technology Design II-37
SoC-Equipped Nanorobots II-37
6. SOC INTELLECTUAL PROPERTY (IP) II-38Interconnect - A Growing Sector of Semiconductor IP Market II-38
7. SOC TECHNOLOGICAL DEVELOPMENTS BY SELECT MARKET PLAYERS II-39
System-on-a-Chip (SoC) for Printers II-39
W-OFDM-SoCs II-39
Xilinx® Virtex™ FPGAs and Embedded Solutions II-39
EPON-Based System-on-a-Chip (SoC) II-40
RapidChip® SoC Prototyping Platform II-40
Analog Devices Othello-E Transceiver II-40
True System-on-a-Chip (SoC) II-41
8. PRODUCT DEVELOPMENTS & LAUNCHES II-42Fujitsu Unveils Three SoC Products II-42Texas Instruments Develops SoC Architecture Based on MulticoreDSPs II-42Broadcom Launches New Bluetooth SoC Solution II-43Triad Semiconductor Unveils Mocha-1™ Line of SoCs II-44Broadcom Releases High Definition Cable Converter Box II-45STMicroelectronics Unveils STi7108 System-on-Chip II-45DesignArt Unveils DAN3000 System-on-Chip Platform II-46Freescale Unveils i.MX508 Application Processor to SupporteReaders II-47Digi Releases Rabbit 6000 II-48GlobalFoundries Releases SoC Platform Jointly with ARM II-48CSEM Introduces Customized SoC with Integrated DSP II-49Broadcom Rolls Out Foremost DTA SoC Solution II-49NEC Electronics to Launch Camera Engine 151 SoC II-50Scintera Networks Launches SC1887: Adaptive RFPAL System-on-Chip II-51Actions Semiconductor Launches Series 25 Product Range II-52ChipWrights Unveils CW5631 SoC Based Hardware Development Kit II-52Multi-Protocol, Multi-Rate PHY Offered as Single SoC Solution II-53Conexant Unveils SoC Solution CX92137 II-54AppliedMicro Launches APM 83290 SoC II-54Ambarella Introduces A5s SoC II-56Silicon Laboratories Releases EZRadio Wireless IC Solution II-56Savi Technology Launches RFID SoC II-57DiBcom Releases Tuner-Demodulator SoC for DVB-T and ISDB-T II-58Sigma Releases SMP8656 Media Processor SoC II-58Dust Networks Launches ARM Cortex-M3 Processor II-58Teridian Launches 6618 Energy Measurement SoC II-59DesignArt Launches DAN3000 SoC Series II-60Broadcom Unveils WLAN Router SoC Solutions II-61Cavium Networks Introduces PureVu Family of Single-Chip VideoProcessors II-62Broadcom Introduces SoC Solutions for Digital TV Transmissionin Japan II-62IMEC Announces Tools to Optimize MPSoC Design Platforms II-63Maxim Integrated Products Rolls Out MAXQ7667 Microcontroller II-63Creative Introduces ZiiLABS ZMS-05 II-64Xilinx Introduces Innovative Development Kits II-65Symwave Develops Single Chip USB 3.0 SW6316, a Storage Controller II-66Broadcom Introduces MoCA-integrated SoCs in the US Market II-67ViXS Systems Plans to Integrate CryptoFirewall Security intoXCode 4000 Array II-67NEC Electronics Releases Universal Serial Bus 3.0 SoC Design II-68Broadcom Launches Multi-Format HD STB SoC Solution II-68Aptina Unveils SoC Image Sensor II-69Broadcom Unveils PND on a Chip SoC BCM4760 II-70Sequans Communications Launches SQN1220 II-70Atheros Communications Introduces Combined WLAN and BluetoothConnectivity II-71GCT Semiconductor Rolls Out GDM7205 Single Chip Mobile WiMAXSolution II-71Intel Plans to Debut 32-nm Westmere Chips II-72Avnera Introduces AudioMagic 2G II-73Magma Unveils RTL-to-GDSII Reference Flow for POWERVR SGXGraphic Accelerator Cores II-73Cyprus Introduces CY8C28xxx PSoC 1 II-74
9. PRODUCT INNOVATIONS/INTRODUCTIONS - A HISTORIC PERSPECTIVE BUILDER II-76
MosChip Unveiled System-on-a-Chip (SoC) Processor II-76
Freescale Releases MPC8536E PowerQUICC III Processor II-76
Intel Introduces CE3100 Processor II-77
Intel Introduces EP80579 SoC II-78
Samsung Electronics Launches S5K4AW CMOS Image Sensor II-78
Win Enterprises Introduces Two New Network Platforms with
Intel SoC II-78
Panovasic Develops a New System-on-Chip, Apollo I II-79
austriamicrosystems Rolls Out a New SoC Magnetic Rotary Encoder II-80
Cypress Launches a New PSoC NV Series II-80
Neotion Unveils a New Common Interface (CI) Module Range II-81
Intel Unveils Intel Media Processor CE 3100 II-81
Broadcom Launches BCM3545 DTA SoC Solution II-82
Eurotech Introduces Eurotech A3pci8024 II-83
CPU Technology to Launch Acalis CPU872 SoC with Embedded DRAM,
Tamper Protection II-83
picoChip Unveils PC3xx SoC Range for the Femtocell Sector II-83
Samsung Unveils Processors for Digital Photo Frames II-84
Marvell Launches New SoC Devices, Marvell® 88F6000 Series II-85
Ralink to Introduce New PHY and Ethernet Switch Integrated AP/
Router SoC II-85
NEC Introduces New EMMA SoCs with In-Built Advanced H.264 VCS
Support II-86
Freescale Semiconductor Launches New Highly Integrated Two-
Core SoC Device II-86
Novelics Unveils One-Transistor SRAM for SoC Designers II-87
Emerson to Roll Out a Single-board Computer with Dual-Core
PowerPC II-88
ON Semiconductor Expands IP with Several New IP Blocks II-89
GE Fanuc Unveils a New SoC-Based Multicomputer II-89
Mindspeed Introduces Comcerto 300 Series of Access VoIP
Processors II-89
Samsung to Deploy PO4010 Image Sensors in Portable Camera
Handsets II-90
Magnum Semiconductor Releases ZV1050 Multimedia Application
Processor II-90
Broadcom Unveils Advanced Encoder/Transcoder SoC Solution II-91
Broadcom Showcases High Definition Set-Top Box System-on-a-Chip II-92
Broadcom Unveils a Single Chip DBS Set-Top-Box Solution II-92
GCT Semiconductor Unveils SoC Solution Supporting WiMAX and
WiFi Functionality II-92
Infineon Releases CAT-iq™ Wireless Engine II-92
Broadcom Showcases a Whole New Range of SoC Solutions for
Mobile Devices II-92
NVIDIA Introduces an Innovative Applications Processor II-93
Samsung Introduces Single-Chip Decoder II-93
Toshiba Introduces SoC Solution for ATSC LCD HDTVs II-93
Broadcom Uncovers Reference Design Platform for HD Optical
Disc Players II-93
Broadcom Introduces Digital-to-Analog Adapter II-93
STMicroelectronics Introduces 'ST21NFCA' - SoC Solution for
the NFC Market II-94
Broadcom Unveils SoC Solutions for the Mobile TV Market II-94
New Series of IC Tuners from Infineon II-94
TI Integrates Bluetooth®, FM and GPS Technologies on to a
Single Chip II-94
STMicroelectronics Releases Bluetooth® and FM-Radio SoC Solution II-94
Upgraded Version of 90-Nanometer Reference Flow from SMIC and
Synopsys II-95
Syntax-Brillian Opts Digital TV SoC Solution from Broadcom II-95
Broadcom Showcases BCM7400B SoC II-95
Marvell Introduces Bluetooth Single-Chip Solution II-95
D2 Technologies Unveils Embedded VoIP Software II-95
Broadcom Rolls Out the New BCM4325 Single-Chip II-96
Westinghouse Digital Selects BCM3560 SoC Solution II-96
Broadcom Releases the BCM7118 Single Chip II-96
Infineon Launches 3G ADSL2+ SoC II-96
ARC International Launches New VRaptor™ Media Architecture II-96
MOSAID Rolls Out Memorize™ and Fractional-N PLL II-97
Starport Systems Unleashes SoC Solution for Gen2 UHF RFID Readers II-97
Alvand Technologies Unveils SoC Humming-B™ Family of Tuners II-97
MagnaChip Releases MC531EA SoC Imaging Solution II-97
Genesis Microchip Unveils the Chaplin DTV family of ICs II-97
PMC-Sierra Unveils the PAS65311 GPON ONT Reference Design
Solution II-98
STMicroelectronics Unleashes the SPEAr Head600 and SPEAr
Plus600 ICs II-98
CAST, Inc. Rolls Out the SOC Kernels II-98
ARM and Northwest Logic's PCI-SIG-compliant solution II-98
Cypress Releases The PSoC Express 2.1 II-98
Texas Instruments Unveils Single-Chip NaviLink™ 5.0 Solution II-99
Sonics Launches New Version of SonicsMX® SMART Interconnect™
Solution II-99
SanDisk to Roll Out 8-Gb & 16Gb MLC NAND Flash Memory Chip II-99
10. RECENT INDUSTRY ACTIVITY II-100Synopsys to Take Over Magma Design Automation II-100Broadcom Takes Over Provigent II-100IXYS Acquires Zilog II-100HEATCON® Acquires Asset Rights and Technology from EE Solutions II-100Ralink Merges Operations with TrendChip II-101Broadcom Partners with Skyworth-Hitune II-101Broadcom Acquires Teknovus II-102Carbon Design Teams Up with VeriSilicon II-102austriamicrosystems Broadens Use of Cadence Technology II-102SiS Selects Cadence Design Systems II-103Renesas Electronics America Begins Operations as Subsidiary ofRenesas Electronics II-104Novatek Chooses Tensilica HiFi Audio Frequency DSP II-104Arrow Electronics Takes Over ETEQ Components II-105MIPS Technologies Joins Forces with Tensilica II-105CoWare and Tensilica Collaborate II-106Marvell and E Ink Announce the Availability of Marvell®ARMADA™, 166E Application Processor II-106Virage Logic Announces Acquisition of NXP's Horizontal CMOSSemiconductor IP Rights and Development Team II-107Virage Logic Announces Purchase of ARC International II-108Sigma Designs to Take Over Coppergate Communications II-108CoWare and ARM Collaborate II-109Cadence Inks Collaboration Agreement with ARM II-110Samsung Electronics and Sigma Designs Collaborate II-111Entropic and ViXS Systems Collaborate to Develop HD NASReference Design II-111BroadLight, Jungo Announce Partnership for GPON ResidentialGateway Reference Platform II-112Entropic and Intel Digital Home to Announce Collaboration II-113MosChip and IdealBT Sign Technology Partnership II-113UEI Acquires Universal Remote Control Software Technology andAssociated Assets from Zilog II-114Synopsys Acquires CHIPit Business Division of ProDesign II-115Mentor Graphics Takes Over LogicVision II-115Fujitsu to Use Atrenta's SpyGlass-CDC Product to Reduce DesignRisks II-115
11. STRATEGIC CORPORATE DEVELOPMENTS - A HISTORIC PERSPECTIVE BUILDER II-117
ZF Micro and Chip-1 Exchange Signs Distribution Agreement II-117
eSilicon Associates with SiCortex for HPC Products II-117
Arrow Electronics Takes Over Excel Tech II-118
Comtrend Deploys BL2348 GPON RG SoC Solution of BroadLight II-118
ARM Inks Technology Licensing Agreement with Toshiba II-118
ARC Inks Licensing Agreement with TM Technology II-119
Elpida Memory Inks Partnership Agreement with UMC II-119
Silvus Technologies Inks Partnership Agreement with Ittiam
Systems II-120
China Digital TV Inks Collaboration Agreement with Intel II-120
NextWave Wireless and Huawei Collaborate II-121
Teradyne Acquires Eagle Test II-122
Billion Electric Deploys BroadLight BL2348RGSoC Solution II-123
Sigma Designs Inks Collaboration Agreement with Microsoft II-123
Broadcom Acquires DTV Business of AMD II-124
Arkados and STMicro Enters into Agreement to Produce HomePlug
AV SoC II-125
Airtel Selects Broadcom to Introduce DTH TV Service II-125
GainSpan Enters into Strategic Partnership with Ekahau II-126
NEC Signs Agreement with IBM II-126
Intel Enters into Partnership with Yahoo II-126
Mindspeed Technologies Forms Alliance with ARM II-127
Gennum Takes Over ASIC Architect II-127
DSP Group Licenses VoStoc from SPIRIT DSP II-127
Pixelplus Signs Agreement with KC Uppertech II-128
Wasion and Teridian Enter into an Alliance II-128
ON Semiconductor Acquires AMI Semiconductor II-128
Broadcom Takes Over Sunext Design II-128
Broadcom Collaborates with Microsoft II-129
Broadcom Along with Coship Provides HD Set-Top Box Solution in
China II-129
Zilog Signs Distribution Agreement with Nu Horizons II-129
BroadLight partners with ITRI II-129
ARC Extends Collaboration Agreement with Toshiba II-129
Samsung Uses Integrated FM Radio and Bluetooth® SoC from Broadcom II-130
NEC Opts Wipro to Provide Semiconductor Design Solutions II-130
Axiom Invests US$3 Million for New R&D Center in India II-130
Matsushita Implements IC Compiler of Synopsys II-130
EtherWaves Acquires Sonarics II-130
Silicon Image Acquires sci-worx II-131
Cortina Systems Acquires ImmenStar II-131
Wipro Acquires OTCS II-131
Synopsys Acquires MOSAID IP Assets II-131
BroadLight Collaborates with OpenCon Systems II-131
Mindspeed Partners with Terawave II-131
IC Nexus Partners with HDL Design House II-132
Global Unichip Allies with Vivante Graphics II-132
Jazz and Fujitsu Join Forces II-132
Coronis Systems Partners with Essensium N.V. II-132
Global Unichip Opts Testing Solution from Synopsys II-132
Core Logic to Establish Solution Center in China II-133
Newark Signs Franchise Agreement with Cypress II-133
Silicon Image Signs an Accord with Sunplus II-133
ARC Signs Multiple Agreements II-133
Global IP Sound Changes to Global IP Solutions II-133
Faraday Forms an Alliance with Palmchip Corporation II-133
CAST Enters into a Distribution Agreement with S2C II-134
Renesas - ZMD Alliance to Introduce 900-MHz Band ZigBee®
Chipset by 2008 II-134
Renesas Enters into an Agreement with Key Stream Corporation II-134
Renesas and Matsushita into their Fifth Stage of Collaboration II-134
Renesas Employs Synopsys' VCS Verification Solution and VMM
Methodology II-134
Renesas Adopts Synopsys' IC Compiler Solution II-135
S2C Inc. is Tensilica® Inc.'s New Prototyping Partner in China II-135
Sonics Inc.® Enters into an Agreement with Ricoh Company II-135
MoSys Adopts SMIC's CMOS Process Technology II-135
e2v Opts Tower Semiconductor to Manufacture CMOS Image Sensors II-135
Haier Group Adopts Broadcom's Digital TV System-on-Chip Solution II-135
12. FOCUS ON SELECT PLAYERS II-136Microsemi SoC Products Group (US) II-136Altera Corporation (US) II-136ARM Holdings Plc (UK) II-136Broadcom Corporation (US) II-137Freescale Semiconductor, Inc. (US) II-137GCT Semiconductor Inc. (US) II-137Infineon Technologies AG (Germany) II-138Intel Corporation (US) II-138LSI Corporation (US) II-139Marvell Technology Group Ltd. (US) II-139Panasonic Corporation (Japan) II-139Mentor Graphics Corporation (US) II-140Renesas Electronics Corporation (Japan) II-140NVIDIA Corporation (US) II-141Palmchip Corporation (US) II-141Samsung Electronics Co., Ltd. (South Korea) II-142STMicroelectronics N.V. (Switzerland) II-142Synopsys, Inc. (US) II-142Taiwan Semiconductor Manufacturing Co., Ltd. (Taiwan) II-143Texas Instruments Inc (US) II-143Toshiba America Electronics Components, Inc (US) II-144Xilinx Inc. (US) II-144Zilog Inc. (US) II-144ON Semiconductors Corporation (US) II-145Ziptronix, Inc. (US) II-145
13. GLOBAL MARKET PERSPECTIVE II-146
Table 5: World Recent Past, Current & Future Analysis for
System-on-a-Chip (SoC) by Geographic Region/ Country - US,
Canada, Japan, Europe, Asia-Pacific (Excluding Japan) and Rest
of World Markets Independently Analyzed with Annual Sales
Figures in US$ Million for Years 2009 through 201 (includes
corresponding Graph/Chart) II-146
Table 6: World Historic Review for System-on-a-Chip (SoC) byGeographic Region/Country - US, Canada, Japan, Europe,Asia-Pacific (Excluding Japan) and Rest of World MarketsIndependently Analyzed with Annual Sales Figures in US$Million for Years 2003 through 2008 (includes correspondingGraph/Chart) II-147
Table 7: World 15-Year Perspective for System-on-a-Chip (SoC)
by Geographic Region/ Country - Percentage Breakdown of Dollar
Sales for US, Canada, Japan, Europe, Asia-Pacific (Excluding
Japan) and Rest of World Markets for Years 2003, 2011 and 2017
(includes corresponding Graph/Chart) II-148
Global Market for System-on-a-Chip (SoC) by Product Type II-149
Table 8: World Recent Past, Current & Future Analysis for
System-on-a-Chip (SoC) by Product Type - SoCs Based on
Standard Cell and SoCs Based on Embedded IP Markets
Independently Analyzed with Annual Sales Figures in US$
Million for Years 2009 through 2017(includes corresponding
Graph/Chart) II-149
Table 9: World Historic Review for System-on-a-Chip (SoC) byProduct Type - SoCs Based on Standard Cell and SoCs Based onEmbedded IP Markets Independently Analyzed with Annual SalesFigures in US$ Million for Years 2003 through 2008 (includescorresponding Graph/Chart) II-150
Table 10: World 15-Year Perspective for System-on- a-Chip
(SoC) by Product Type - Percentage Breakdown of Dollar Sales
for SoCs Based on Standard Cell and SoCs Based on Embedded IP
Markets for Years 2003, 2011 and 2017 (includes corresponding
Graph/Chart) II-151
Global Market for System-on-a-Chip (SoC) by End-Use Application II-152
Table 11: World Recent Past, Current & Future Analysis for
System-on-a-Chip (SoC) by End-Use Application - Computers,
Communications Equipment, Consumer Electronics Devices,
Automotive Applications and Other Markets Independently
Analyzed with Annual Sales Figures in US$ Million for Years
2009 through 2017 (includes corresponding Graph/Chart) II-152
Table 12: World Historic Review for System-on-a- Chip (SoC)by End-Use Application - Computers, Communications Equipment,Consumer Electronics Devices, Automotive Applications andOther Markets Independently Analyzed with Annual SalesFigures in US$ Million for Years 2003 through 2008 (includescorresponding Graph/Chart) II-153
Table 13: World 15-Year Perspective for System-on- a-Chip
(SoC) by End-Use Application - Percentage Breakdown of Dollar
Sales for Computers, Communications Equipment, Consumer
Electronics Devices, Automotive Applications and Other
Markets for Years 2003, 2011 and 2017 (includes corresponding
Graph/Chart) II-154
III. MARKET
1. THE UNITED STATES III-1
A.Market Analysis III-1
Rise in SoC End-Use Sectors Drives the Growth III-1
Technological Innovations Add to Growth III-1
The U.S. Companies Follows Outsourcing Strategy to Reduce Costs III-1
Semiconductors Market in North America III-1
Focus on Select Players III-2
Atmel Corporation III-2
BroadLight, Inc. III-2
Cadence Design Systems, Inc III-2
Conexant Systems, Inc III-2
CPU Technology, Inc III-3
Cypress Semiconductor Corporation III-3
Enpirion Inc. III-3
Eureka Technology, Inc. III-3
Fujitsu Semiconductor America, Inc. III-4
IBM Microelectronics III-4
Mindspeed Technologies, Inc. III-4
MIPS Technologies Inc. III-4
National Semiconductor Corporation III-5
Renesas Electronics America Inc. III-5
NeoMagic Corporation III-5
PMC-Sierra Inc. III-6
S2C Inc. III-6
Sonics, Inc III-6
Wipro Technologies III-7
Major End-Users III-7
RF Micro Devices Inc III-7
B.Market Analytics III-8
Table 14: US Recent Past, Current & Future Analysis for
System-on-a-Chip (SoC) Market with Annual Sales Figures in
US$ Million for Years 2009 through 2017 (includes
corresponding Graph/Chart) III-8
Table 15: US Historic Review for System-on-a-Chip (SoC)Market with Annual Sales Figures in US$ Million for Years2003 through 2008 (includes corresponding Graph/Chart) III-9
2. CANADA III-10
Market Analytics III-10
Table 16: Canadian Recent Past, Current & Future Analysis
for System-on-a-Chip (SoC) Market with Annual Sales Figures
in US$ Million for Years 2009 through 2017(includes
corresponding Graph/Chart) III-10
Table 17: Canadian Historic Review for System-on-a- Chip(SoC) Market with Annual Sales Figures in US$ Million forYears 2003 through 2008 (includes corresponding Graph/Chart) III-11
3. JAPAN III-12
A.Market Analysis III-12
An Overview of Japanese Semiconductor Market III-12
Consumer Profile III-12
Foreign Players Tie-Up with Local Fabricators and Vendors III-12
Local Companies Expand Customer Base III-12
Growth in IC Sector III-12
Hitachi, Ltd. - A Select Player III-13
B.Market Analytics III-14
Table 18: Japanese Recent Past, Current & Future Analysis
for System-on-a-Chip (SoC) Market with Annual Sales Figures
in US$ Million for Years 2009 through 2017(includes
corresponding Graph/Chart) III-14
Table 19: Japanese Historic Review for System-on-a-Chip(SoC) Market with Annual Sales Figures in US$ Million forYears 2003 through 2008 (includes corresponding Graph/Chart) III-15
4. EUROPE III-16
A.Market Analysis III-16
Market Trends III-16
SoC Deployment Rises for the Automotive and the
Communications Sector III-16
Demand for Pre-Configured Functional IP Blocks Rising III-16
Subcontracting Increases for Final SoC Products Assembly to
Low-Cost European Countries III-16
Semiconductors Market Overview III-17
Focus On Select Players III-17
Essensium NV (Belgium) III-17
Renesas Electronics Europe GmbH (Germany) III-17
Nordic Semiconductor (Norway) III-18
B.Market Analytics III-18
Table 20: European Recent Past, Current & Future Analysis
for System-on-a-Chip (SoC) Market with Annual Sales Figures
in US$ Million for Years 2009 through 2017(includes
corresponding Graph/Chart) III-18
Table 21: European Historic Review for System-on-a-Chip(SoC) Market with Annual Sales Figures in US$ Million forYears 2003 through 2008 (includes corresponding Graph/Chart) III-19
5. ASIA-PACIFIC III-20
A.Market Analysis III-20
Asia Emerges as a Major Market for SoC Deployment in
Wireless Devices III-20
China III-20
India III-21
Overview on Semiconductor Industry III-21
SoC Market III-21
From Just Design to Complete Solutions III-21
Challenges Faced III-22
South Korea III-22
Korean SoC Market on a Rise III-22
Integrated Circuits (ICs) Market III-22
Focus On Select Players III-23
5V Technologies Taiwan, Ltd (Taiwan) III-23
Dongbu HiTek Company Ltd. (South Korea) III-23
EE Solutions, Inc (Taiwan) III-23
Faraday Technology Corporation (Taiwan) III-24
Global Unichip Corporation (Taiwan) III-24
IC Nexus Co., Ltd (Taiwan) III-24
Silicon Motion Technology Corp. (Taiwan) III-24
United Microelectronics Corp. (Taiwan) III-25
B.Market Analytics III-25
Table 22: Asia-Pacific Recent Past, Current & Future
Analysis for System-on-a-Chip (SoC) Market with Annual Sales
Figures in US$ Million for Years 2009 through 2017(includes
corresponding Graph/Chart) III-25
Table 23: Asia-Pacific Historic Review for System- on-a-Chip(SoC) Market with Annual Sales Figures in US$ Million forYears 2003 through 2008 (includes corresponding Graph/Chart) III-26
6. REST OF WORLD III-27
Market Analytics III-27
Table 24: Rest of World Recent Past, Current & Future
Analysis for System-on-a-Chip (SoC) Market with Annual Sales
Figures in US$ Million for Years 2009 through 201 (includes
corresponding Graph/Chart) III-27
Table 25: Rest of World Historic Review for System-on-a-Chip (SoC) Market with Annual Sales Figures in US$Million for Years 2003 through 2008 (includes correspondingGraph/Chart) III-28IV. COMPETITIVE LANDSCAPE
Total Companies Profiled: 191 (including Divisions/Subsidiaries - 212)
------------------------------------------Region/Country Players------------------------------------------The United States 137Canada 5Japan 16Europe 21France 2Germany 2The United Kingdom 7Rest of Europe 10Asia-Pacific (Excluding Japan) 30Middle East 3------------------------------------------
To order this report:Electronic Component and Semiconductor Industry: Global System-On-A-Chip IndustryMore
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