Global Industrial IoT (IIoT) Chipsets Market 2017-2021: Increasing Amount of Data Generation Due to IIoT

News provided by

Jul 05, 2017, 11:30 ET

DUBLIN, July 05, 2017 /PRNewswire/ --

Research and Markets has announced the addition of the "Global Industrial IoT (IIoT) Chipsets Market 2017-2021" report to their offering.

The global industrial IoT chipsets market to grow at a CAGR of 30.03% during the period 2017-2021.

Global Industrial IoT Chipsets Market 2017-2021, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the market landscape and its growth prospects over the coming years. The report also includes a discussion of the Key vendors operating in this market.

Industrial Internet of Things (IIoT) is a communication technology that helps in increasing production efficiency by gathering real-time data from machines on the plant floor. IIoT is enabled in machines through the use of an IIoT semiconductor chipset. The chipset enables the Internet connectivity of the machine through wired or wireless means.

One trend in the market is growing demand for embedded sensors. The semiconductor technology enables the use of sensors in the manufacturing plants. Utilization of sensors and transducers in manufacturing is in demand, owing to the progressive innovations in embedded sensors and Micro-Electro-Mechanical Systems (MEMS) technology.

According to the report, one driver in the market is increasing amount of data generation due to IIoT. The increase in the number of devices in industries is leading to a rise in difficulty in the monitoring and managing of data in an organization. Therefore, the demand for the Machine to Machine (M2M) and machine to human communications has increased simplifying the monitoring and managing of the connected devices enabled with IoT. The data generation is increasing because of the development in connected devices.

Further, the report states that one challenge in the market is intellectual property (IP) based design challenge. To reduce the design effort, components designed for a class of applications are reused. This is commonly seen in software design. In the process of an evolution of existing products, the reuse of blocks has been in practice in the field of application specific integrated circuit (ASIC) design for a long period. Shorter product life cycles have led to rapidly increasing product complexity, where many design companies are referring to module cores from other sources.

Key vendors

Cypress Semiconductor
Intel
NXP Semiconductor
STMicroelectronics
Texas Instruments

Other prominent vendors

Cisco
Advanced Micro Devices
Toshiba
Qualcomm
Infineon Technologies
NVIDIA
Philips
GE
Siemens

Key Topics Covered:

Part 01: Executive summary

Part 02: Scope of the report

Part 03: Research Methodology

Part 04: Introduction

Part 05: Market landscape

Part 06: Market segmentation by application

Part 07: Geographical segmentation

Part 08: Decision framework

Part 09: Drivers and challenges

Part 10: Market trends

Part 11: Vendor landscape

Part 12: Key vendor analysis

Part 13: Appendix

For more information about this report visit https://www.researchandmarkets.com/research/j5dtpd/global_industrial

Media Contact:

Research and Markets
Laura Wood, Senior Manager
[email protected]

For E.S.T Office Hours Call +1-917-300-0470
For U.S./CAN Toll Free Call +1-800-526-8630
For GMT Office Hours Call +353-1-416-8900

U.S. Fax: 646-607-1907
Fax (outside U.S.): +353-1-481-1716

SOURCE Research and Markets