FlipChip International and Cookson Electronics Announce Polymer Collar Technology Patent License Agreement

PHOENIX,  Aug. 16 /PRNewswire/ -- FlipChip International (FCI) today announced that it has signed a patent license agreement with Cookson Electronics covering its intention to facilitate the industry's ease in adopting the use of Polymer Collar™ technology to enhance the drop-shock and thermal cycling reliability of area array packages, particularly wafer level packages used for hand-held devices.  By purchasing polymer flux from Cookson, package manufacturers will be permitted to practice the Polymer Collar™ process without the concern of patent infringement.

"FCI has developed some valuable IP for the industry.  We have found that most of the leading package suppliers to the hand-held market have a strong interest in Polymer Collar™ technology, but have been reluctant to implement the technology due to their concern over possible patent infringement," said Chris Bastecki, Vice President and General Manager at Cookson Electronics Semiconductor Products.   "This license agreement really opens the path and facilitates the full industry utilization of this enabling technology," continued Bastecki.

Bob Forcier, Chief Executive Officer at Flip Chip International, said, "We are excited by our continued technical advancements and in our ability to develop enabling, green technologies that can advance performance and miniaturization for the mobile market.  The Polymer Collar™ process has the potential to expand the use of wafer level packages to larger die sizes and increased functionality."

FlipChip International, LLC is a privately held supplier of products and services for the wafer bumping and wafer scale packaging semiconductor market and is a recognized leader in WLCSP and flip chip bumping.  FCI is a wholly owned subsidiary of RoseStreet Labs LLC, a supplier of products and services for the semiconductor, life science, and renewable energy markets.  For more information, visit www.flipchip.com.

Cookson Electronics – Semiconductor Products (CESP), a Cookson Electronics company, is a leader in the development, manufacturing and sales of innovative materials used in semiconductor packaging market. CESP supplies high performance materials for soldering processes (Alpha® fluxes, polymer fluxes, solder paste, and solder spheres); for die attach applications (ATROX™ and POLYFUZE™); for optimization of the package environment for high reliability (HiCap™ moisture getters and H2-3000 hydrogen getters), and for encapsulation materials (PLASKON® epoxy mold compounds). For more information, visit www.cooksonsemi.com.

SOURCE FlipChip International