BeSang and SK Hynix Sign Patent License Agreement

BEAVERTON, Ore., Oct. 29, 2013 /PRNewswire/ -- BeSang Inc., the pioneer in TRUE 3D^TM IC solutions, announced today it has signed a patent license agreement with SK hynix Inc. This license agreement covers the use of BeSang's patented innovations to be implemented in a broad range of 3D IC products offered by SK hynix Inc.   

"SK hynix is a top global semiconductor industry leader. Therefore, SK hynix is an important customer and this agreement validates the strength of BeSang's TRUE 3D^TM IC solutions," said Dr. Sang-Yun Lee, CEO of BeSang Inc. "We look forward to the opportunity to expand our customer relationships beyond patent license agreements to showcase our technical contributions and know-how with customers."

BeSang's TRUE 3D^TM IC technology enables vertical stacking of multiple device layers, and offers low cost and high-performance solutions to CPU, DSP, GPU, ASIC, FPGA, SoC, DRAM, SRAM, flash, image sensor, and SSD applications. BeSang has successfully demonstrated its disruptive TRUE 3D^TM IC technologies in 2008.

About BeSang Inc.

BeSang is a pioneer in the design, development, and delivery of unsurpassed three-dimensional (3D) IC solutions, providing unmatched process and design technologies for TRUE 3D^TM IC as well as technology licenses to customers. BeSang provides high-value intellectual properties related to its proprietary TRUE 3D^TM ICs. The fabless semiconductor company is headquartered in Beaverton, Oregon, USA. Additional information is available at www.besang.com.

SOURCE BeSang Inc.