230 Teams Worldwide Join ASC17 to Challenge AI and TaihuLight
ZHENGZHOU, China, Feb. 17, 2017 /PRNewswire/ -- 2017 ASC Student Supercomputer Challenge (ASC17) held its opening ceremony at Zhengzhou University and hundreds of supercomputing experts and team representatives from worldwide attended the opening ceremony. A total of 230 teams will challenge the world 's fastest supercomputer Sunway TaihuLight, artificial intelligence application, Gordon Bell Award nomination application, and compete for top 20 places in the finals.
The number of teams registered ASC17 Challenge has reached a new high, up 31% compare to the last year. The competition platforms and applications have been designed to reflect the leading-edge characteristic: Sunway TaihuLight and the most advanced supercomputer in Henan province, located in the middle of China, will perform different competition applications. Baidu's AI application, intelligent driving traffic prediction and a high-resolution global surface wave simulation MASNUM_WAVE, a 2016 Gordon Bell Prize finalist will give teams the opportunities to challenge the "Super Brain" and the "Big Science". Meanwhile, ASC17 finals will select top 20 teams, compared to 16 teams in previous years.
Endong Wang, initiator of the ASC challenge, academician of the Chinese Academy of Engineering and Chief Scientist at Inspur, said that one key objective of hosting an annual ASC Challenge is to help students understand the deep learning algorithms, acquire the knowledge relating to big data and cutting-edge computing technologies, and cultivate supercomputing talent for the future.
The ASC Student Supercomputer Challenge is initiated by China, and supported by experts from industries and institutions worldwide. The competition aims to be the platform to encourage young supercomputing talents to share ideas with other participants from different countries and regions It also aims to be the key driving force in promoting technological and industrial innovations by improving the standards in supercomputing applications and research.
SOURCE Inspur Electronic Information Industry Co., Ltd
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